Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

Dr. Zhou Limin, Senior Director of Strategic Marketing at MRSI Systems introduced the exhibition center which was established to provide an opportunity for the Chinese optoelectronics industry to fully understand the detailed performance of MRSI-HVM3. Through live demonstrations, users can understand the packaging process capability of MRSI’s flexible, efficient and high-precision placement equipment. Interested companies are invited to visit, MRSI-HVM3 is available for on-site demonstration, and welcome companies to carry samples for proofing and testing by appointment.

This offers existing and prospective customers in China the opportunity to review the detailed performance capability of the MRSI-HVM3 in a local setting, supported by MRSI’s world-class local application engineers for a quick turn-around of product demonstration and die bonding sample building.

Founded in Massachusetts in 1984, MRSI Systems has been focused on providing flexible, efficient, high-reliability die bonding solution for telecommunications/datacom (data center), aerospace and defense, medical equipment, computers and peripherals, and industrial applications. MRSI offers “one-stop-shop” die bonding solutions for research and development, low-to-medium volume production, and high volume manufacturing of optoelectronic industry products. With more than 30 years of industry experiences and MRSI Systems’ global network of technical support teams, the most efficient system and packaging solutions for all types of chip packages, including chip-on-wafer (CoW), chip-on-substrate (CoS), chip on PCB board (CoB) and the gold-box packaging. MRSI has been recognized as an industry standard, providing solutions to the world’s leading optoelectronic and microelectronics customers.

For high-volume and high-mix production characteristics of the optical communications industry, optical communications companies need flexible, high-speed, high-precision automation technologies to address the timely supply and rapid innovation of the data center market and upcoming 5G critical components. The flexibility of MRSI Systems equipment is also well suited for the development and production of other types optoelectronic devices. The MRSI-HVM3 series products are recognized as the industry’s leading first-class die bonding machine with its leading speed and <3 micron bonding accuracy. Flexible and high-volume die bonding process solution are available for CoC, CoS and CoB packages that include both eutectic and/or epoxy processes. Through its dual heads, dual eutectic bonding stations, “zero time” changeover system configuration, ultra-fast eutectic bonding temperature ramp up/down and multi-function parallel fully automatic process, the MRSI-HVM3 series products have excellent performance.

At present, the MRSI-HVM3 equipment in the Shenzhen Demonstration Center can be configured with maximum flexibility on this one machine, enabling multiple processes and multiple chips to be completed in one machine. Using one highly integrated die bonding machine can replace multiple machines for R&D and production, one-stop-shop solution can simultaneously have high-precision, high-capacity and fast-production capabilities, achieve maximum productivity through the parallel processing design, and fully improve return on investment (ROI). The machine positioning repeatability <±3μm@ 3 sigma to meet the innovative needs in future designs. The core of the MRSI-HVM3 die bonding machine is that its 3-axis (XYZ) has a resolution of 50nm, which is an important guarantee for high precision, high mixing, high speed flexibility and reliable die bonding. The company with the strongest technical ability, multi-functional “one-stop-shop” solution to help customers to enhance the strength of R&D and production.

In terms of 5G, MRSI Systems has launched a new MRSI-H3TO die bonding machine for 5G wireless network optoelectronic devices. The TO-Can package with multi-chip transceivers or multi-chip TO (such as WDM and EML TO) products applied for 5G key devices. The MRSI-H3TO is a new high-speed die bonding machine developed based on the needs of new TO devices. It can perform TO pick-and-place process and bonding process, dual-head motion system in parallel. In addition, the machine also adopts a “zero-time” nozzle changer, which enables zero-time replacement of nozzles between different chips, enabling multi-chip, multi-process in single-process production on one machine for maximum throughput. Dr. Yi Qian, Vice President of Marketing at MRSI Systems, pointed out that this new MRSI-H3TO is exactly the type of die bonding machine required by our customers to manufacture next-generation TO-Can Optoelectronic devices such as WDM and EML-TO. The MRSI-H3TO die bonding machine achieves industry-leading speed while maintaining high flexibility and precision.

In the high-power semiconductor laser market, MRSI Systems also launched MRSI-H3LD 3 micron high-speed die bonding machine, which is especially suitable for the large chip die bonding for single-emitter laser die and Bar-laser die in high-power semiconductor lasers, which is widely used in industrial lasers, pump laser, laser sources and sensors, as well as other  advanced optoelectronic applications.  High-power semiconductor lasers are the key components in many industrial market applications, and their demand has been growing at a high speed, and the new applications are exploding. The new MRSI-H3LD is equipped with an integrated “zero-time” tool replacement, ultra-fast, high-stability eutectic heater and multi-level parallel optimization process, thus reducing the die bonding cycle time and improving the process repeatability, and achieving the highest production efficiency in the industry.

MRSI Systems was founded with the concept of quality first.  After more than 30 years of development, MRSI System has built the strongest team in the field of application and service in the field of die bonding manufacturing through strong technical abilities and after-sales service.  At the Shenzhen Demonstration Center, MRSI Systems is equipped with an excellent after-sales service team to respond quickly to customer needs.

If you need to visit the MRSI Systems die bonding solution at the MRSI Mycronic Shenzhen Demonstration Center, or if you are interested in sample proofing or testing, please contact MRSI Systems. MRSI has extended product configurations including HVM3e, HVM3P, H3TO, and H3LD, which are based upon the same design as HVM3, but configured specifically for local top heating, in-line conveyor CoB, AOC and gold-box packaging, WDM & EML TO-can packaging and high power laser diode packaging.

Translated from original source: Infostone