MRSI receives Laser Focus World Innovators Award for H-TO die bonder

The MRSI-H-TO was recognized for an innovative design that resulted in marked improvement over previous methods employed, approaches taken, or products/systems used. The MRSI-H-TO is the industry’s first 1.5 micron ultra-flexible, high-speed die bonder platform for multi-dies, and multiple-processes, targeting the new complex TO-based photonic device volume manufacturing for the high-speed DCI, and 5G wireless network rollout.

The MRSI-H family of 1.5 micron ultra-flexible, high-speed machines is widely used by the optoelectronics industry. The MRSI-H-TO variant provides a highly demanded high-volume manufacturing solution for new complex TO-based photonic device. This machine can handle multiple sizes of TO cans, such as TO38/46/56/65/72, and both eutectic and epoxy processes can be completed in one machine. The platform is equipped with the MRSI patented fast tool changer, dual fast heating and cooling eutectic stages and multi-process parallel processing capability to maximize productivity, while maintaining maximum flexibility.

A customer who has been operating the MRSI-H-TO machine over the last two years said, “The machine provides high productivity and high stability, which proves that it is the best solution for multi-chip and multi-process complex TO packaging. The machine also supports CoC and gold box packaging. It is a very flexible machine that makes our production line highly agile, which our customers appreciate. MRSI also has a very professional and highly dedicated local service team that provides support around the clock.”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI, said, “We are honored to receive the Laser Focus World’s Annual Innovators Award again, which signifies that MRSI’s innovation capabilities continue to be recognized and valued by industry experts. The trust placed upon us by customers and industry experts continues to inspire us to deliver cutting edge innovations for the optoelectronics industry.”

For additional information, please contact:

Jennifer Russo
Marketing Manager, MRSI Systems (Mycronic Group)
Tel: +1 (978) 495-9731, e-mail:  jennifer.russo@mycronic.com
Time Zone: ET – Eastern Time

About Laser Focus World

Published since 1965, Laser Focus World has become the most trusted global resource for engineers, researchers, scientists, and technical professionals by providing comprehensive coverage of photonics technologies, applications, and markets. Laser Focus World reports on and analyzes the latest developments and significant trends in both the technology and business of photonics worldwide — and offers greater technical depth than any other publication in the field.

About MRSI Systems

MRSI Systems (Mycronic Group) is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems. We offer solutions for research and development, low-to-medium volume production, and high-volume manufacturing of photonic devices such as lasers, detectors, modulators, AOCs, WDM/EML TO-Cans, Optical transceivers, LiDAR, VR/AR, sensors, and optical imaging products. With 30+ years of industry experience and our worldwide local technical support team, we provide the most effective systems and assembly solutions for all packaging levels including chip-on-wafer (CoW), chip-on-carrier (CoC), PCB, and gold-box packaging.

About Mycronic 

Mycronic is a Swedish high-tech company engaged in the development, manufacture and marketing of production equipment with high precision and flexibility requirements for the electronics industry. Mycronic’s headquarters are located in Täby, north of Stockholm and the Group has subsidiaries in China, France, Germany, Japan, the Netherlands, Singapore, South Korea, United Kingdom and the United States. Mycronic is listed on Nasdaq Stockholm.