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我们的 产品系列

MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s value is further illustrated by our 40+ years of experience in the industry in tandem with our 24/7 reliable field operations.

0.5微米贴片机

MRSI-S-HVM是为集成光子器件量产制造的应用而设计的,可用于半导体晶圆级封装,多芯片、多工艺在一台机器上生产。

Gantry Mounted Pick and Place Head with Integrated Patented Tool Changer

1微米贴片机

高速,灵活的1微米贴片机,适应大批量生产

MRSI-HVM Wafer

1.5微米贴片机

Advanced high accuracy solutions for flexibility and volume production.

3微米贴片机

The ultra flexible MRSI-M3 die bonders can be used for research and development prototyping to low/medium volume.

5微米贴片机

The ultra flexible MRSI-705 and MRSI-705HF die bonders can be used for research and development prototyping to low/medium volume.

高精度环氧树脂点胶机

MRSI-175Ag 环氧树脂点胶机可处理要求最高的点胶应用,如微波模块、光学模块、混合电路、多芯片模块和半导体封装。

双六轴有源光学耦合台

MRSI A-L 是一款模块化设备,集成了自动取放、点胶、视觉、耦合等功能,以及提供灵活编程的智能软件。它是光学组件组装(如收发器、硅光子学、阵列波导光栅、激光雷达、集成光学等)的强大工具。