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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Why do customer's choose MRSI?
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High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
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MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
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High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics Die Bonding Systems
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LIDAR, AR/VR/MR
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Eutectic die bonding
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Eutectic die bonding
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Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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High precision flip-chip die bonders
我们的 产品系列
High Precision Flip-chip Die Bonders
0.5微米贴片机
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3微米贴片机
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5微米贴片机
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2024/8/14 19:18:17
