MRSI-H Family
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MRSI-H Family
- High speed and flexible
- 1.5-micron flip-chip die bonders for high volume manufacturing
- Advanced high accuracy solution for flexibility and speed
Benefits of MRSI-H Family
The MRSI-H family provides proven superior flexibility for true multi-die, multi-process, multi-product high volume high mix production. These high-speed products deliver the industry-leading speed without sacrificing flexibility, precision or reliability. The MRSI-H family targets the manufacturing challenges driven by AI cluster expansion, wireless network rollout and LIDAR market for autonomous driving. MRSI reclassified H series by application.
MRSI-H-LD
- This standard system is widely used in advanced photonics such as lasers, receivers, transceivers, lighting, and sensors, etc.
- Carries key technological building blocks from our field-proven, flexible and high-speed MRSI-HVM platform
- Heated head option designed for the higher density eutectic packaging
- “On-the-fly” patented auto tool changer has twelve vacuum tips/collets integrated on the bonding head for zero time tool change
MRSI-H-HPLD
- Specifically designed for bonding large high-power laser diodes in mass production
- Capable of die bonding single emitter, bar laser in different packages, like CoS, C-mount, Bar-on-Submount(BoS), etc. within one machine
- Customized design self-leveling tools for Co-planarity solution
MRSI-H-HPLD+
- Enhanced MRSI-H-HPLD with significantly higher speed.
MRSI-H-LDMOS
- Specifically designed for bonding GaAs, Si, GaN, SiC dies for RF Power Amplifiers and Microwave Applications in mass production
- Programmable die scrubbing process for a void free bonding process
- Inline heaters, conveyors and loader/unloader options for improve UPH
MRSI-H-TO
- Specifically designed for handling multi-dies and multi-processes for complex TO products without tool changeover. e.g. TO-based EMLs and WDM LDs for 5G
- TO handling module combined with pick and place head for dual parallel processing
- Capability of both epoxy and eutectic die bonding in one process flow
Value to our Customers
- Industry leading throughput, superior flexibility, and ultra-high-accuracy in high-volume, high-mix manufacturing
- Easy to use icon-based interface running on a Windows™ platform for ease of programming, and low-cost machine maintenance.
- Industry leading local technical support teams and application expertise
- 40+ years of experiences in the industry with reliable 24/7 field operation
Images
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MRSI-H with Conveyor
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MRSI-H-HPLD+
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MRSI-H-TO
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Gantry Mounted Pick and Place Head with Integrated Patented Tool Changer
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MRSI-H-TO input and output tray
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MRSI-HVM dual wafer table holding wafer, waffle pack, Gel-Pak® on wafer table adaptor
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MRSI-H Configuration Table
Videos
Brochures
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MRSI-H
For detailed Data Sheets please contact Sales.
MRSI-H
Contact us
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