Prototyping and small batch die bonding services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
Process Development
Meet with our experienced Applications Engineers to learn more about how to develop and design processes. We can also help to test the process for you on our industry-leading die bonders. We strive to shorten your time from lab to fab. Make us your first stop as you re-shore your production.
Applications
- Photonics
- Chiplets & Microelectronics
- Microwave & RF
- Sensors
Services
- Ultra High Precision Die Bonding
- Hybrid Bonding
- Eutectic Bonding
- Epoxy Bonding
- UV Bonding
- Flip-Chip Bonding
- Thermal Compression Bonding
- Wafer-Level Packaging
- Custom Process Development
- Prototyping to Production
- Small batch production
Contact us
Contact us to discuss your assembly requirements and we can help to bridge the gap between design and production.