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Under the MRSI brand, we offer industry-leading die bonders, with superior flexibility, ultra-high-accuracy, and multiple process options. Our product’s' value is further illustrated by our 35+ years of experience in the industry in tandem with our 24/7 reliable field operations.
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History
Why do customer's choose MRSI?
Partners
Testimonials
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High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
Products
MRSI values our customers, and our top priority is meeting our customers needs down to the finest detail. We are proud that all of our products are industry-leading, with superior flexibility, ultra-high-accuracy, and multiple process options.
Visit page Products
High precision flip-chip die bonders
Submicron Die Bonders
1 micron die bonders
1.5 micron die bonders
3 Micron Die Bonders
5 micron die bonders
High Precision Epoxy Dispensers - MRSI-175Ag
Active Aligners
Prototyping and training services
Prototyping
MRSI Systems Training Services
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics Die Bonding Systems
Sensors
LIDAR, AR/VR/MR
Applications
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Photonics
AOC
High Power Laser Diodes
Optical Components & Transceivers
Microwave & RF
RF Power Amplifier & Microwave Device
Microelectronics Die Bonding Systems
Sensors
LIDAR, AR/VR/MR
Processes
Die bonding
Eutectic die bonding
Epoxy die bonding
Processes
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Die bonding
Eutectic die bonding
Epoxy die bonding
News & events
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Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
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Events
Photonics West 2024
Chiplet Summit 2024
OFC 2024
SEMICON West 2024
IMAPS New England 2024
Compound Semiconductor Conference
Webinars
Contact us
MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
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Visit our contact page for contact details for our sales and support departments.
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MRSI North America
MRSI Automation (Shenzhen) Co., Ltd.
Mycronic Sweden HQ
Mycronic Global
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News & events
MRSI Events
Upcoming Events
Past Events
7月9日 - 7月11日
San Francisco, CA USA
SEMICON West 2024
SEMICON West includes the extended microelectronics industry supply chain. MRSI Booth: South Hall #764
Die bonding
United States of America
English
6月18日 - 6月20日
Washington, DC, USA
IMS - International Microwave Symposium 2024
IMS is focused on the microwave industry. MRSI Booth: #1649 Walter E. Washington Convention Center, Washington, DC, USA
Die bonding
United States of America
English
5月22日 - 5月23日
Suzhou, China
Compound Semiconductor Conference
Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry – Generative AI”
Die bonding
United States of America
English
5月7日
Boxborough, MA, USA
IMAPS New England 2024
International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Die bonding
United States of America
English
3月26日 - 3月28日
San Diego, CA USA
OFC 2024
MRSI Booth #1800
Die bonding
United States of America
English
3月20日 - 3月22日
Shanghai New International Expo Center
LASER World of PHOTONICS CHINA 2024
Asia’s largest trade fair for the photonics industry. MRSI Booth #W1.1230
Die bonding
China
Chinese
3月18日 - 3月21日
Fountain Hills, AZ, USA
IMAPS Device Packaging Conference
The 20th Annual Device Packaging Conference (DPC 2024) is an event organized by the International Microelectronics Assembly and Packaging Society (IMAPS). It is a premier event this spring for the microelectronics assembly advanced packaging, that will bring together distinguished industry engineers, researchers, and experts while showcasing the latest developments in photonics and microelectronics. Booth: #55
Die bonding
United States of America
English
3月6日 - 3月8日
Marina Bay Sands Singapore
Asia Photonics Expo 2024
MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23
Die bonding
Singapore
English
2月6日 - 2月8日
Santa Clara, CA USA
Chiplet Summit 2024
MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event totally dedicated to the skyrocketing chiplet market. Booth #215
Die bonding
United States of America
English
1月30日 - 2月1日
San Francisco, CA USA
Photonics West 2024
Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5409
Die bonding
United States of America
English
10月3日 - 10月5日
San Diego, CA, USA
IMAPS San Diego 2023
The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain technologies. Booth: #621
Die bonding
United States of America
English
10月2日 - 10月4日
Glasgow, Scotland
ECOC
The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703
Die bonding
United Kingdom of Great Britain and Northern Ireland
English
10月2日 - 10月5日
Online Event
Automotive LIDAR 2023
Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics Devices,” on Thursday, October 5th, 2023.
Die bonding
United States of America
English
9月7日
Shenzhen, China
China International Optoelectronic Expo Conference
Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era” during the Optoelectronic Chip Design, Manufacturing and Packaging Technology Forum.
Die bonding
China
English
9月6日 - 9月8日
Shenzhen, China
CIOE – China International Optoelectronic Expo
CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention & Exhibition Center Shenzhen, China. Booth: #10B79
Die bonding
China
English
9月4日
Shenzhen, China
Infostone Optical Communication Market and Technology Conference (IFOC) 2023
Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“
Die bonding
China
English
7月11日 - 7月13日
Shanghai, China
LASER World of PHOTONICS CHINA
Asia’s largest trade fair for the photonics industry. Shanghai New International Expo Center. MRSI Booth: 7.1B141
Die bonding
China
Chinese
7月11日 - 7月13日
San Francisco, CA USA
SEMICON West
SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762
Die bonding
United States of America
English
6月13日 - 6月15日
San Diego, CA
IMS - International Microwave Symposium
IMS is focused on the microwave industry. MRSI Booth: #2243
Die bonding
United States of America
English
6月5日 - 6月7日
Suzhou, China
Auto Lidar Tech Conference
MRSI to exhibit and present. Booth: #B-068
Die bonding
China
English
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