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Events
- SEMICON West 2025
- CIOE – China International Optoelectronic Expo 2025
- IMS - International Microwave Symposium 2025
- IMAPS New England 2025
- OFC 2025
- LASER World of PHOTONICS CHINA 2025
- Asia Photonics Expo 2025
- Nepcon Thailand 2025
- IMAPS Device Packaging Conference 2025
- ECOC 2025
- SPIE Photonics West 2025
- Chiplet Summit 2025
- Automotive LIDAR 2024
- Optica Executive Forum at OFC 2025
- IMAPS Boston 2024
- ECOC 2024
- China International Optoelectronic Conference 2024
- CIOE – China International Optoelectronic Expo 2024
- Infostone Optical Communication Market and Technology Conference (IFOC) 2024
- IMAPS Device Packaging Conference
- CIOE – China International Optoelectronic Expo
- EPIC (European Photonics Industry Consortium) TechWatch at CIOE
- IMS - International Microwave Symposium
- Infostone Optical Communication Market and Technology Conference (IFOC) 2023
- ECOC
- IMS - International Microwave Symposium 2024
- Automotive LIDAR 2023
- IMAPS New England 2024
- Photonics West 2024
- IMAPS New England
- LASER World of PHOTONICS CHINA 2024
- LASER World of PHOTONICS CHINA
- Compound Semiconductor Conference
- SEMICON West 2024
- Asia Photonics Expo 2024
- IMAPS San Diego 2023
- SEMICON West
- OFC 2024
- Chiplet Summit 2024
- Auto Lidar Tech Conference
- China International Optoelectronic Expo Conference
- Massachusetts Manufacturing Mash-Up
- Webinars
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Press releases
- MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
- 新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备，引领精密光学组件封装新纪元
- MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions
- MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging
- MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示
- MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
- MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023
- MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo
- MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
- MRSI Mycronic Opens New Demo Center in Shenzhen, China
- MRSI launches new die bonders with improved accuracy
- MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021
- MRSI-S-HVM Submicron Die Bonder won the award for “Infostone 2020 The Most Competitive Optical Communications Product”
- MRSI-S-HVM亚微米贴片机荣获“讯石2020年度光通信最具竞争力产品”
- MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute
- MRSI推出升级版MRSI-705贴片机 助力大批量制造
- MRSI launches MRSI-705 high-volume configuration
- MRSI发布为硅光器件、协同封装和晶圆级封装提供亚微米级贴片解决方案
- MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
- MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效
- MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
- MRSI Files Patent Infringement Lawsuit Against Palomar Technologies
- MRSI HVM系列贴片机荣获Laser Focus World创新者奖
- MRSI receives Laser Focus World Innovators Award for HVM die bonder
- MRSI to offer die bonding demonstrations at Productronica
- MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
- MRSI to present at 18th ICCSZ OC Market and Technology Seminar and offer die bonder demonstrations at CIOE
- MRSI将出席第18届ICCSZ OC市场与技术研讨会，并在CIOE提供贴片演示
- MRSI宣布MRSI-H / HVM系列贴片机精度提升至1.5微米
- MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
- MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监
- MRSI Systems Welcomes Dr. Limin Zhou as Senior Director of Strategic Marketing
- MRSI Systems，迈康尼集团宣布与Lumentum达成新合作，将为汽车行业提供创新的激光雷达解决方案
- MRSI Systems 荣获“2021 Laser Focus World创新大奖”
- MRSI to present at Automotive LIDAR 2021
- MRSI,Mycronic中国深圳新的产品演示中心正式成立
- MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权
- MRSI receives Laser Focus World Innovators Award for H-TO die bonder
- MRSI launches new Die Bonder with improved throughput for high power laser manufacturers
- MRSI Systems, Mycronic Group announces a new collaboration to provide LiDAR solutions for the Automotive Industry
- MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret
- MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
- MRSI Systems welcomes Hendry He as China Country Sales Director
- MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023
- MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder
- IBM Joint Development Agreement (JDA)
- MRSI Systems Acquires Die Bonding Business
- MRSI-M3 Three Micron Die Bonder with One Micron Option
- MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN
- MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction
- MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
- MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
- MRSI Systems Will Demonstrate New Product MRSI-HVM3 and Sponsor the 1st Laser Executive Forum at CIOE in Shenzhen, China, September 6-9, 2017
- MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative
- MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions
- Mycronic acquires MRSI Systems, LLC
- MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
- MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
- MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
- MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
- MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
- MRSI钱毅博士：5G时代自动化贴片系统的发展趋势
- MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
- MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
-
News
- MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference
- Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
- MRSI Support for Application Specific Pickup Tip Designs
- Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology
- Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions
- The High-Performance and Flexible MRSI A-L for Optical Assembly
- MRSI shines at May events: showcased and featured
- Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions
- Optimizing Die Bonding with Planarity Control: Ensuring Precision in Device Attachment Across Industries
- Exploring Automotive LiDAR Packaging Trends
- Explore the Future of Photonics Industry with MRSI at CSC 2024 Conference
- Advancing Microelectronics: MRSI Mycronic’s Presence at IMAPS New England
- The MRSI-H1 Family: Unleashing Precision and Agility
- Join us in March!
- MRSI-705HF 5 micron high force die bonder won the award for “Infostone 2023 Optical Communication Most Competitive Equipment
- MRSI New Solution: Tape Holder
- Automotive LiDAR: Photonics assembly requirements and trends
- MRSI-705HF High Force Die Bonder for power devices and advanced chip packaging
- Advanced Packaging for Heterogeneous Integration
- Advancing automation: unleashing the power of the automatic tool changing turret
- MRSI Mycronic to present at Automotive LIDAR 2023
- Join us at IMAPS in San Diego!
- Join MRSI at ECOC 2023 – The European Conference on Optical Communication
- MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
- Join MRSI at the China International Optoelectronic Conference (CIOE)
- MRSI Air-Knife Needle Cleaning System
- Learn why the MRSI-705 is an industry leader in flexibility and reliability
- Learn more about MRSI’s Training Programs
- Visit MRSI at SEMICON West in San Francisco
- MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos
- Watch MRSI’s Software Training Videos
- MRSI to present and attend Auto Lidar Tech 2023
- Join MRSI at IMS in San Diego
- Dr. Limin Zhou to present at the CHIP China Conference
- An update on our free software training video program
- MRSI to sponsor and present at IMAPS New England this May
- Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
- MRSI Systems is excited to launch our free software training video program!
- Jon Medernach to retire after a triumphant twenty years at MRSI Systems
- MRSI-175Ag – A flexible epoxy dispensing solution
- Join MRSI Systems at IMAPS Device Packaging Conference this spring!
- MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
- Experience MRSI’s latest innovations at the OFC Exhibition
- Improve pick and place machine utilization by keeping dies in their places
- Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?
- MRSI’s heated head die bonder targets High-Density Photonic Devices
- Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article
- Optoelectronics Packaging
- Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
- How to Choose an Epoxy Dispenser
- Epoxy Die Bonding of Ultra Small Ceramic Capacitors
- Die Bonding Process Pages – Highlights
- Die Bonding Solutions
- Challenges and Solutions in the Photonics Packaging Industry
- Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)
- How to Choose a Die Bonding System
- How Does MRSI Systems Manufacture to Customer’s Specification?(2)
- Mycronic technology essential in 5G development
- Multiple Die Eutectic Bonding
- Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)
- Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)
- Join MRSI at the 50th European Conference on Optical Communication
- Join us at IMAPS in Boston!
- Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation
- Join MRSI at SPIE Photonics West in San Francisco
- The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
- MRSI to present and attend 4th LiDAR Tech 2022
- MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022
- MRSI will be attending and sponsoring IMAPS Boston 2022
- MRSI to exhibit at the European Microwave Week in Milan
- MRSI Mycronic to Present at Automotive LIDAR 2022
- Visit MRSI at ECOC in Basel, Switzerland
- MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
- MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen
- MRSI to present at LaserFocusCon 2022
- MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
- ECTC San Diego 2022 Highlights
- Visit MRSI at the Compound Semiconductor Advanced Technology & Application Conference
- Come visit us at the International Microwave Symposium
- Visit MRSI at ECTC in San Diego
- Join MRSI at SEMICON West 2022
- MRSI is presenting and sponsoring the iMAPS New England 48th Symposium and Expo
- Learn more about how MRSI solves RF PA device manufacturing challenges
- MRSI to exhibit at LASER World of PHOTONICS Munich
- Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing
- Visit MRSI at IMAPS Device Packaging in Arizona
- MRSI is exhibiting at the Optical Fiber Conference
- MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
- MRSI Systems (Mycronic Group) 应邀出席2021（第三届）激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲
- MRSI Systems received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
- The Versatile MRSI-HVM
- Visit MRSI at SPIE Photonics West 2022
- Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market
- MRSI presented at the 12th China International Nanotechnology Industry Expo
- Visit MRSI at SEMICON West in San Francisco
- Bruno Afonso joins MRSI – Sales
- 专访MRSI SYSTEMS周利民：MRSI-HVM-p系列贴片机助力光通讯产业高速发展
- MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
- MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
- MRSI Systems最新1.5μm系列产品荣获“中国光电博览奖”银奖
- MRSI to present at Automotive LIDAR 2021
- MRSI Shenzhen Demo Center grand opening ceremony
- MRSI Systems受邀出席光收发器和硅基光电子论坛
- Irving Wang joins MRSI – Product Marketing
- MRSI-705 innovative high-volume configuration for lower cost manufacturing
- Die bonding solution targets modern photonics manufacturing – building bricks for 5G rollout
- MRSI Systems – CIOE 2020 & IFOC 2020 Highlights
- IMAPS 2020 Virtual Exhibition
- Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
- MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition
- MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos
- MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
- MRSI solves one of the greatest challenges in modern photonics manufacturing
- Join MRSI at the International Microwave Symposium
- SEMICON West 2020 Virtual Event
- MRSI’s heated head die bonder targets High-Density Photonic Devices
- Advanced Photonics Applications – MRSI-H-LD
- LASER World of PHOTONICS CHINA 2020
- High-power Laser Diode Manufacturing Challenges
- Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges
- MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
- MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era
- Meet with MRSI Systems at Photonics West in San Francisco
- MRSI Systems to Exhibit MRSI-H-LD at Productronica
- IMAPS Boston 2019 – Highlights
- Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
- MRSI to Sponsor and Exhibit at the 2019 International Symposium on Microelectronics in Boston
- Automotive LIDAR Conference and Exhibition 2019
- MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
- Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
- Thank You for Visiting MRSI at the International Microwave Symposium in Boston
- Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
- Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
- Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
- Join MRSI Systems at SEMICON West 2019
- Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
- MRSI Systems World Class Customer Support – Jack Inocencio
- International Microwave Symposium 2019
- Visit MRSI Systems at SEMICON China 2019 in Shanghai
- Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing
- Great Week at SPIE Photonics West 2019
- MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019
- Visit MRSI Systems at the Optical Fiber Conference in San Diego
- MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions
- MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
- MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting
- High Volume Manufacturing of Photonic Components and Modules
- Challenges in Die Bonding of Gallium Nitride High Power Devices
- MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums
- Automotive LIDAR Conference 2018: AI & Autonomous Vehicles
- Highlights of the Microelectronics Symposium
- MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
- MRSI Systems—New Process Pages
- Photonics Manufacturing for the Hyperscale Data Center Era
- International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
- Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders
- Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform
- MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
- Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
- SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
- International Microwave Symposium 2018
- Building Complex Hybrid Circuits-Advanced Packaging
- International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo
- MRSI Systems Launches New Software Video Training Programs
- Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications
- Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
- MRSI Systems’ Customer Support – Peter Cronin
- MRSI Systems Supports “Advancing Innovation in Photonics”
- MRSI Systems’ Exceptional Customer Support
- Join MRSI Systems at OFC!
- MRSI Systems is Exhibiting at SPIE Photonics West
- Fully Automated Die Bonding Systems — The Importance of Proper Lighting
- High Volume Manufacturing of Photonic Devices: Assembly Starts with Design
- Visit MRSI Systems at Productronica 2017 in Munich, Germany
- International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
- High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)
- Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
- China International Optoelectronic Expo – September 2017
- IMS 2019 Boston
- 2017 International Microwave Symposium Highlights
- What is the Future of Optoelectronics Packaging?
- Technology Students Experience Local Advanced Technology Manufacturer Up Close
- Hybrid Electronics Technology for Printed Lighting
- MRSI Systems’ Sales Team – Jon Medernach
- MRSI Participated in the 2017 Electronic Components and Technology Conference(ECTC)
- iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”
- 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights
- ECTC – The 67th Electronic Components and Technology Conference
- MRSI Systems Participated in MIT Microphotonics Center / AIM Photonics Spring Technical Meeting in Cambridge
- 4 Recent Topics in Advanced Packaging
- International Microwave Symposium 2017
- MRSI Systems Customer Support Team – Ezer Espares
- Automated Die Bonding for High Volume Optoelectronics Packaging
- Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster
- Challenges in High-Volume Manufacturing for Die Attach Systems
- Advanced Vision Systems
- Case Study – The Latest Die Bonding Solutions for Photonics Manufacturing
- Innovation Continues on MRSI-705HF
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