Technical articles archive
2023
NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI
2022
Top-Interview-with-Compound-Semiconductor-China-Dr.-Limin-Zhou-MRSI-Mycronic-Group-2022
2021
Automating RF PA Device Manufacturing as seen in Chip Scale Review March/April 2021
Dr. Limin Zhou OFweek Interview 2021
Dr. Limin Zhou Interview with OFweek 2021 (Chinese).pdf
Infostone Interview with MRSI Systems 2021 English
MRSI will build a new DEMO Center in Shenzhen China to support the rapid development of China’s photonics industry
Abstract: In this year’s Laser World of Photonics China(Shanghai), MRSI Systems continues to bring the most advanced 1.5 micron high-speed, high-precision, ultra-flexible automatic die bonder to provide on-site demonstration for domestic device manufacturers. The MRSI-H series die bonders are the industry’s proven solution for high-precision photonic production devices.
Infostone Interview with MRSI Systems 2021 (Chinese)
Interview with Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems (Video)
2020
Assembly solution addresses TO-can photonic device manufacturing challenges
为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
Flexible high-volume die bonding solution targets modern photonics manufacturing
2019
Die-bonder innovations target HPLD manufacturing challenges
A Die Bonding Solution for Packaging High-Power Laser Diode Chips and Bars (Chinese Version)
Die-bonder-innovations-target-HPLD-manufacturing-challenges-Japanese
Challenges of photonics manufacturing in new data era (Chinese Version)
Challenges for photonics manufacturing in the new data center era
2018
High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions
Originally published in Chip Scale Review – July August 2017 Issue
2016
Advanced-eutectic-packaging-for-volume-manufacturing-of-photonics-MRSI
Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version).pdf Originally published in Chip Scale Review – July August 2016 Issue 适用于光子、微波及 RF 电子产品量产的先进共晶封装
Applying Automated Solutions to Photonics Manufacturing
Automating Military Hybrids and Microwave Module Assembly
High Precision Die Bonding for Photonics Packaging
Automating Hybrid Circuit Assembly
Automatic ChipPlacement: One Solution, User-Benefits and Future Development
Automated Techniques Improve Microwave-Module Assembly
Next-generation Electronics Packaging Using Flip Chip Technology.