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OFC 2026

The exhibition will feature more than 670 industry-leading companies representing the entire ecosystem of optical communications and networking. Attendees have the opportunity to explore

Event

GOMACTech 2026

GOMACTech was established primarily to review developments in microcircuit applications for government systems. Established in 1968, the conference has focused on advances in systems being

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SPIE Photonics West 2026

Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and optoelectronics. Booth: #5145

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LASER World of PHOTONICS CHINA 2026

die-bonding CN zh-Hans Shanghai New International Expo Centre (SNIEC) Laser World of Photonics China LASER World of PHOTONICS CHINA 2026 Asia’s largest trade fair for the photonics industry in

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SEMICON West 2025

SEMICON West includes the extended microelectronics industry supply chain.

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ECOC 2025

die-bonding DK en Copenhagen, Denmark ECOC 2025 50th European Conference on Optical Communication The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication

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SEMICON West 2026

SEMICON West includes the extended microelectronics industry supply chain.

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Infostone Optical Communication Market and Technology Conference (IFOC) 2024

die-bonding CN zh-Hans Shenzhen, China IFOC Logo 2024 Infostone Optical Communication and Market Technology Conference (IFOC 2024) Location: Shenzhen World Exhibition & Convention Center,

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LASER World of PHOTONICS CHINA 2025

die-bonding CN zh-Hans Shanghai New International Expo Centre (SNIEC) Laser World of Photonics China LASER World of PHOTONICS CHINA 2025 Asia’s largest trade fair for the photonics industry in

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SPIE Photonics West 2025

die-bonding US en San Francisco, CA USA Photonics West 2025 Photonics West 2025 Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and

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GOMACTech 2025

die-bonding US en Pasadena, CA, USA GOMACTech 2025 GOMACTech 2025 Annual Government Microcircuit Applications & Critical Technology Conference (GOMACTech) Exhibition: March 18-19, 2025

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ECOC 2024

die-bonding DE en Frankfurt, Germany ECOC 2024 50th European Conference on Optical Communication The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication

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Automotive LIDAR 2024

die-bonding US en Online Automotive LIDAR 2024 7th Annual Conference and Exhibition. MRSI Mycronic will be presenting. International Microwave Symposium

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Chiplet Summit 2025

die-bonding US en Santa Clara, CA USA Chiplet Summit 2025 Chiplet Summit 2025 MRSI Mycronic is sponsoring the Chiplet Summit at the Santa Clara Convention Center. Booth #314

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KPCA Show 2023

bare-board-testning KR en Hall 2~4, Songdo Convensia, Incheon, Korea KPCA Show 2023 KPCA Show 2023 Organized by Korea Electronics Packaging and Circuits Association (KPCA) Managed by  KY

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HKPCA Show 2023

bare-board-testning CN en Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen / China HKPCA Show 2023 All-day event Location: Shenzhen World Convention & Exhibition Center

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SEMICON Southeast Asia 2026

die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.

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IMAPS New England 2026

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

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IMS - International Microwave Symposium 2026

MRSI to exhibit at the International Microwave Symposium 2026.

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NEPCON Thailand 2025

MRSI is exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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Optica Executive Forum at OFC 2025

die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -

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The Innovation Conference on CPO (Co-Packaged Optics)and Heterogeneous Integration Technology

Dr. Limin Zhou to present AI-Driven High-Speed Optical Module Packaging Tech Trends at The Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology.

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Wafer-Level Packaging Symposium 2025

die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February

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Asia Photonics Expo 2026

die-bonding SG en Marina Bay Sands, Singapore Asia Photonics Expo 2026 Asia Photonics Expo 2026 MRSI will be exhibiting at the Asia Photonics Expo from February 4-6, 2026. Booth #B214 Asia

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MRSI Systems – ATC Auto Lidar Webinar

die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of

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Massachusetts Manufacturing Mash-Up

die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.

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HKPCA 2025

bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2025

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JPCA 2024

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024

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KPCA 2025

bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025

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IPC 2026

bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026