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Infostone Optical Communication Market and Technology Conference (IFOC) 2023
die-bonding CN en Shenzhen, China IFOC Logo 2023 IFOC Location: Shenzhen, China. Dr. Limin Zhou to present “Automotive Lidar Package & Assembly Technology Evolution Trend“
ECOC
die-bonding GB en Glasgow, Scotland ECOC 2023 ECOC 2023 The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry. Booth: #703
IMS - International Microwave Symposium 2024
die-bonding US en Washington, DC, USA International Microwave Symposium International Microwave Symposium IMS is focused on the microwave industry. MRSI Booth: #1649 Walter E. Washington
Automotive LIDAR 2023
die-bonding US en Online Event Automotive LIDAR 2023 Automotive LIDAR 2023 Dr. Irving Wang, Director of Marketing, MRSI Systems, Mycronic Group, will present “High-Volume Assembly of Photonics
IMAPS New England 2024
die-bonding US en Boxborough, MA, USA IMAPS logo IMAPS New England International Microelectronics Assembly and Packaging Society (IMAPS) New England 50th Symposium & Expo.
Photonics West 2024
die-bonding US en San Francisco, CA USA Photonics West 2024 Photonics West 2024 Photonics West is the world’s premier event for lasers, biomedical optics, biophotonics, quantum, and
IMAPS New England
die-bonding US en Boxborough, MA, USA IMAPS New England International Microelectronics Assembly and Packaging Society (IMAPS) New England 49th Symposium & Expo.
LASER World of PHOTONICS CHINA 2024
die-bonding CN zh-Hans Shanghai New International Expo Center Laser World of Photonics China LASER World of PHOTONICS CHINA Asia’s largest trade fair for the photonics industry. MRSI Booth
LASER World of PHOTONICS CHINA
die-bonding CN zh-Hans Shanghai, China Laser World of Photonics China LASER World of PHOTONICS CHINA Asia’s largest trade fair for the photonics industry. Shanghai New International Expo Center.
SEMICON West 2024
die-bonding US en San Francisco, CA USA SEMICON West 2024 SEMICON West includes the extended microelectronics industry supply chain. MRSI Booth: South Hall #764
Asia Photonics Expo 2024
die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2024 Asia Photonics Expo 2024 MRSI will exhibit at the Asia Photonics Expo 2024. Booth: EF-23
IMAPS San Diego 2023
die-bonding US en San Diego, CA, USA IMAPS San Diego 2023 IMAPS San Diego 2023 The International Symposium on Microelectronics IMAPS is focused on microelectronics and packaging supply chain
Chiplet Summit 2024
die-bonding US en Santa Clara, CA USA Chiplet Summit 2024 Chiplet Summit 2024 MRSI is sponsoring the Second Annual Chiplet Summit at the Santa Clara Convention Center. It is the only event
Auto Lidar Tech Conference
LIDAR Tech
Laser Focus World Webinar – Gen AI: Catalyst for Optical Module Innovation
die-bonding US en Online Laser Focus World Webinar – Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Mycronic and General Manager of
IEEE Photonics Webinar
die-bonding US en MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an
SEMICON Southeast Asia 2026
die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.
IMAPS New England 2026
International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.
IMS - International Microwave Symposium 2026
MRSI to exhibit at the International Microwave Symposium 2026.
NEPCON Thailand 2025
MRSI is exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.
Optica Executive Forum at OFC 2025
die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -
The Innovation Conference on CPO (Co-Packaged Optics)and Heterogeneous Integration Technology
Dr. Limin Zhou to present AI-Driven High-Speed Optical Module Packaging Tech Trends at The Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology.
Wafer-Level Packaging Symposium 2025
die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February
Asia Photonics Expo 2026
die-bonding SG en Marina Bay Sands, Singapore Asia Photonics Expo 2026 Asia Photonics Expo 2026 MRSI will be exhibiting at the Asia Photonics Expo from February 4-6, 2026. Booth #B214 Asia
MRSI Systems – ATC Auto Lidar Webinar
die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of
Massachusetts Manufacturing Mash-Up
die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.
HKPCA 2025
bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2025
JPCA 2024
bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024
KPCA 2025
bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025
IPC 2026
bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026