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bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2025

bare-board-testning CN en at National Exhibition & Convention Centre, Shanghai / China CPCA Show 2026

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024

bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025

bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2024

bare-board-testning US en at Anaheim Convention Center, California IPC 2024

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2025

die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of

MRSI Mycronic is proud to be a Silver Sponsor of the Optica Executive Forum again this year. Co-located with OFC, the Premier Event in Telecom and Data Center Optics this is an Optica Industry

SEMICON China connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the

die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry, attracting over 8,300 decision-makers from across the industry.

MRSI to exhibit at the International Microwave Symposium 2026.

die-bonding US en San Francisco, CA USA Photonics Society Of Chinese Heritage (PSC) Photonics Society Of Chinese Heritage (PSC) OFC Annual Conference and Workshop MRSI Mycronic is sponsoring the

die-bonding US en Phoenix, AZ, USA IMAPS Device Packaging 2025 IMAPS Device Packaging 2025 The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6,

MRSI is exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -

Dr. Limin Zhou to present AI-Driven High-Speed Optical Module Packaging Tech Trends at The Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology.

die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February

die-bonding US en Boston, MA, USA IMAPS Boston 2024 International Microelectronics Assembly and Packaging Society (IMAPS) Boston 2024 The International Symposium on Microelectronics is focused on

die-bonding SG en Marina Bay Sands, Singapore Asia Photonics Expo 2026 Asia Photonics Expo 2026 MRSI will be exhibiting at the Asia Photonics Expo from February 4-6, 2026. Booth #B214 Asia

die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2025 Asia Photonics Expo 2025 MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General Manager of MRSI Automation (

die-bonding CN en Shenzhen, China EPIC (European Photonics Industry Consortium) TechWatch at CIOE On September 11th, 2024, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems,

die-bonding CN en Shenzhen, China CIOE Logo 2024 China International Optoelectronic Exposition (CIOE) 2024 CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention

die-bonding US en Suzhou, China Compound Semiconductor Conference Banner Compound Semiconductor Conference Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry –

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era”

die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.