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die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era”

die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.

die-bonding US en San Francisco, CA USA SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762

die-bonding US en San Diego, CA USA Optical Fiber Communication Conference® and Exposition 2024 Optical Fiber Communication Conference® and Exposition MRSI Booth #1800

MRSI is exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

die-bonding US en Phoenix, AZ, USA IMAPS Device Packaging 2025 IMAPS Device Packaging 2025 The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6,

die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2025 Asia Photonics Expo 2025 MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111

die-bonding US en Boston, MA, USA IMAPS Boston 2024 International Microelectronics Assembly and Packaging Society (IMAPS) Boston 2024 The International Symposium on Microelectronics is focused on

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General Manager of MRSI Automation (

MRSI-A-L ACTIVE ALIGNER MRSI Mycronic has been serving optoelectronic customers for the past 40+ years and understands their requirement to scale efficiently in today’s fast-paced marketplace.

MRSI-LEAP ULTRA HIGH SPEED DIE BONDER • Very high throughput • Exceptionally stable, up to ±1μm @ 3σ placement accuracy • Supports multiple wafers and multiple automated tool changes MRSI

MYPro series A40EX™ pick-and-place Specifications May 2026 Specifications MYPro series A40EX™ SYSTEM FEATURES MYPRO A40EX On-the-fly mount order optimization Vision autoteach with

Mycronics årsstämma 2026 VD Anders Lindqvist Framgångsrikt år • 2025 var ett rekordår både vad gäller orderingång och nettoomsättning • Vi tecknade avtal

Protokoll fört vid årsstämma i Mycronic AB (publ), org. nr 556351–2374, den 6 maj 2026 på Nytorpsvägen 9 i Täby, kl. 17:00 – 17:50 § 1 Stämman öppnades

High-performance 3D AOI made simpler and faster Mycronic inspection solutions MYPro I™ series 3D AOI MYPro I series 3D AOI Put your inspection on autopilot At Mycronic, we’re on a mission to

High-performance 3D AOI made simpler and faster Mycronic inspection solutions MYPro I™ series 3D AOI MYPro I series 3D AOI Put your inspection on autopilot At Mycronic, we’re on a mission to

Mycronic MYPro™ Line Accessories and software 2026 Accessory catalog Smart accessories for the SMT assembly shop floor Pick-and-place Feeders and accessories Mycronic’s Agilis™ feeder

Driving Mask Manufacturing Excellence The MYIntelligence Suite Scalable Digital Platform for Smarter Mask Manufacturing MYIntelligence enables manufacturers to operate with greater

Driving Mask Manufacturing Excellence The MYIntelligence Suite Scalable Digital Platform for Smarter Mask Manufacturing MYIntelligence enables manufacturers to operate with greater

TRANSLATION FROM THE SWEDISH ORIGINAL Auditor’s report in accordance with Chapter 8, Section 54 of the Swedish Companies Act (2005:551) on whether the guidelines adopted by the General Meeting

Revisorsyt t rande enligt 8 kap. 54 § akt iebolagslagen (2005:551) om bolagsst ämmans rikt linjer avseende ersät tningar t ill ledande befat tningshavare har följt s Till bolagsstämman

Mycronic AB (publ) Annual general meeting Wednesday May 6 2026 Form for postal voting The form must be received by Computershare AB (which administers the Annual general meeting and the forms

The Nomination Committee’s statement to its proposed Board of Directors of Mycronic AB (publ), reg. no. 556351-2374 for the Annual General Meeting on May 6, 2026 Background The

The Nomination Committee’s proposal to the Annual General Meeting (AGM) on May 6, 2026, in Mycronic AB (publ) regarding the establishment of a Nomination Committee for the AGM 2027 The

Proxy The proxy stated below is hereby authorized to vote for all of the undersigned shareholder’s shares in Mycronic AB (publ), corp. id. no. 556351-2374, at the Annual General Meeting in