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bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024

bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025

bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2024

bare-board-testning US en at Anaheim Convention Center, California IPC 2024

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2025

die-bonding US en Phoenix, AZ, USA IMAPS Device Packaging 2025 IMAPS Device Packaging 2025 The 21st Annual Device Packaging Conference (DPC 2025) will be held in Phoenix, Arizona, on March 3-6,

die-bonding US en San Francisco, CA USA Optica Executive Forum at OFC 2025 Optica Executive Forum at OFC 2025 MRSI Mycronic is sponsoring the Optica Executive Forum at OFC 2025. Executive Forum -

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems, Mycronic Group, and General Manager of MRSI Automation (

die-bonding US en San Francisco, CA, USA Wafer-Level Packaging Symposium Wafer-Level Packaging Symposium 2025 The Wafer-Level Packaging Symposium will be held in San Francisco, CA from February

die-bonding CN en Shenzhen, China CIOE Logo 2024 China International Optoelectronic Exposition (CIOE) 2024 CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention

die-bonding US en Boston, MA, USA IMAPS Boston 2024 International Microelectronics Assembly and Packaging Society (IMAPS) Boston 2024 The International Symposium on Microelectronics is focused on

die-bonding SG en Marina Bay Sands Singapore Asia Photonics Expo 2025 Asia Photonics Expo 2025 MRSI Mycronic will exhibit at the Asia Photonics Expo 2025. Stand No.: B111

MRSI-A-L ACTIVE ALIGNER MRSI Mycronic has been serving optoelectronic customers for the past 40+ years and understands their requirement to scale efficiently in today’s fast-paced marketplace.

MRSI-LEAP ULTRA HIGH SPEED DIE BONDER • Very high throughput • Exceptionally stable, up to ±1μm @ 3σ placement accuracy • Supports multiple wafers and multiple automated tool changes MRSI

MYPro series A40EX™ pick-and-place Specifications May 2026 Specifications MYPro series A40EX™ SYSTEM FEATURES MYPRO A40EX On-the-fly mount order optimization Vision autoteach with

Mycronics årsstämma 2026 VD Anders Lindqvist Framgångsrikt år • 2025 var ett rekordår både vad gäller orderingång och nettoomsättning • Vi tecknade avtal

Protokoll fört vid årsstämma i Mycronic AB (publ), org. nr 556351–2374, den 6 maj 2026 på Nytorpsvägen 9 i Täby, kl. 17:00 – 17:50 § 1 Stämman öppnades

High-performance 3D AOI made simpler and faster Mycronic inspection solutions MYPro I™ series 3D AOI MYPro I series 3D AOI Put your inspection on autopilot At Mycronic, we’re on a mission to

High-performance 3D AOI made simpler and faster Mycronic inspection solutions MYPro I™ series 3D AOI MYPro I series 3D AOI Put your inspection on autopilot At Mycronic, we’re on a mission to

Mycronic MYPro™ Line Accessories and software 2026 Accessory catalog Smart accessories for the SMT assembly shop floor Pick-and-place Feeders and accessories Mycronic’s Agilis™ feeder

Driving Mask Manufacturing Excellence The MYIntelligence Suite Scalable Digital Platform for Smarter Mask Manufacturing MYIntelligence enables manufacturers to operate with greater

Driving Mask Manufacturing Excellence The MYIntelligence Suite Scalable Digital Platform for Smarter Mask Manufacturing MYIntelligence enables manufacturers to operate with greater

TRANSLATION FROM THE SWEDISH ORIGINAL Auditor’s report in accordance with Chapter 8, Section 54 of the Swedish Companies Act (2005:551) on whether the guidelines adopted by the General Meeting

Revisorsyt t rande enligt 8 kap. 54 § akt iebolagslagen (2005:551) om bolagsst ämmans rikt linjer avseende ersät tningar t ill ledande befat tningshavare har följt s Till bolagsstämman

Fullmakt Härmed befullmäktigas nedanstående ombud att rösta för samtliga undertecknades aktier i Mycronic AB (publ), 556351-2374, vid årsstämma i Mycronic AB

Styrelsens yttrande enligt 18 kap 4 § aktiebolagslagen samt 19 kap 22 § (2005:551) Styrelsen i Mycronic AB (publ), org. nr. 556351-2374 (”Bolaget”), får härmed i enlighet med

ERSÄTTNINGSRAPPORT 2025 1 (5) ERSÄTTNINGSRAPPORT 2025 Inledning Denna ersättningsrapport tillhandahåller en översikt över hur Mycronics ersättningsriktlinjer

Valberedningens förslag till årsstämman den 6 maj 2026 i Mycronic AB (publ) om inrättande av valberedning inför 2027 års årsstämma Valberedningen föreslår

Pressmeddelande Täby, 25 mars 2026 Kallelse till årsstämma i Mycronic AB (publ) Aktieägarna i Mycronic AB (publ), org. nr 556351-2374, kallas härmed till årsstämma