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Productronica China 2024

pcb-assembly CN zh-Hans Shanghai International Expo Centre (SNIEC) Productronica China

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Global industrie 2024

pcb-assembly FR fr Paris Nord Villepinte Global industrie

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TPCA Show 2023

bare-board-testning TW en Nangang Exhibition Hall, Taipei / Taiwan TPCA Show 2023 TPCA Show 2023 PCB Expo Taiwan 1. PCB Manufacturing: manufacture of single-layer PCB, double-layer PCB,

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JPCA Show 2023

bare-board-testning JP en JPCA Show 2023 Location: Tokyo International Exhibition Center, Tokyo, Japan All-day event

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JPCA Show 2026

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo / Japan JPCA Show 2026

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Productronica 2023

bare-board-testning DE de Location: Munich, Germany Productronica 2023 Productronica 2023

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HKPCA 2024

bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2024

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TPCA 2024

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2024

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HKPCA 2025

bare-board-testning CN en at Shenzhen World Convention & Exhibition Center (Baoan), Shenzhen HKPCA 2025

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CPCA 2026

bare-board-testning CN en at National Exhibition & Convention Centre, Shanghai / China CPCA Show 2026

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JPCA 2024

bare-board-testning JP en at Tokyo International Exhibition Center, Tokyo JPCA 2024

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KPCA 2025

bare-board-testning KR en at Songdo Convensia Convention Center, Incheon KPCA 2025

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IPC 2026

bare-board-testning US en at Anaheim Convention Center, California IPC Apex 2026

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IPC 2024

bare-board-testning US en at Anaheim Convention Center, California IPC 2024

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TPCA 2025

bare-board-testning TW en at Nangang Exhibition Hall, Taipei TPCA 2025

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Optica Executive Forum at OFC 2026

MRSI Mycronic is proud to be a Silver Sponsor of the Optica Executive Forum again this year. Co-located with OFC, the Premier Event in Telecom and Data Center Optics this is an Optica Industry

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SEMICON China 2026

SEMICON China connects you to the world's fastest-growing and most dynamic microelectronics market, and gives you the platform to showcase your products, technologies, and brand in front of the

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SEMICON Southeast Asia 2026

die-bonding MY en MITEC, Kuala Lampur, Malaysia SEMICON Southeast Asia 2026 SEMICON Southeast Asia 2026 We are happy to be exhibiting at SEMICON Southeast Asia. Visit MRSI Mycronic Booth #2119.

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IMAPS New England 2026

International Microelectronics Assembly and Packaging Society (IMAPS) New England 52nd Symposium & Expo.

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ECOC 2026

The ECOC Exhibition is the key meeting place for everyone in the fibre optic communication technology industry, attracting over 8,300 decision-makers from across the industry.

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IMS - International Microwave Symposium 2026

MRSI to exhibit at the International Microwave Symposium 2026.

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Asia Photonics Expo 2026

die-bonding SG en Marina Bay Sands, Singapore Asia Photonics Expo 2026 Asia Photonics Expo 2026 MRSI will be exhibiting at the Asia Photonics Expo from February 4-6, 2026. Booth #B214 Asia

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MRSI Systems – ATC Auto Lidar Webinar

die-bonding CN zh-Hans MRSI Systems – ATC Auto Lidar Webinar On March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of

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EPIC (European Photonics Industry Consortium) TechWatch at CIOE

die-bonding CN en Shenzhen, China EPIC (European Photonics Industry Consortium) TechWatch at CIOE On September 11th, 2024, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems,

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CIOE – China International Optoelectronic Expo 2024

die-bonding CN en Shenzhen, China CIOE Logo 2024 China International Optoelectronic Exposition (CIOE) 2024 CIOE is the world’s largest optoelectronics event. Location: Shenzhen World Convention

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Compound Semiconductor Conference

die-bonding US en Suzhou, China Compound Semiconductor Conference Banner Compound Semiconductor Conference Dr. Limin Zhou to present “A New Engine for the Development of Photonics Industry –

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China International Optoelectronic Expo Conference

die-bonding CN en Shenzhen, China CIOE Conference CIOE Conference Location: Shenzhen, China Dr. Limin Zhou will present “The Evolution and Trends of Optoelectronic Chip Packaging in the AI Era”

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Massachusetts Manufacturing Mash-Up

die-bonding US en Gillette Stadium, Foxborough, MA Massachusetts Manufacturing Mash-Up Join us at the 2024 Massachusetts Manufacturing Mash-Up.

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SEMICON West

die-bonding US en San Francisco, CA USA SEMICON West includes the extended microelectronics industry supply chain. Booth: South Hall #762

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OFC 2024

die-bonding US en San Diego, CA USA Optical Fiber Communication Conference® and Exposition 2024 Optical Fiber Communication Conference® and Exposition MRSI Booth #1800