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ECTC San Diego 2022 Highlights

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,

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IEEE Photonics Devices

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

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MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

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Visit MRSI at ECOC in Basel, Switzerland

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

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MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and

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MRSI to exhibit at the European Microwave Week in Milan

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in

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MRSI will be attending and sponsoring IMAPS Boston 2022

MRSI Systems, Mycronic Group will be exhibiting at the 55th International Symposium on Microelectronics from October 4-5th in Boston Massachusetts at the Hynes Convention Center.

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MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions

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MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications

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The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Join MRSI at SPIE Photonics West in San Francisco

die-bonding Join MRSI at SPIE Photonics West in San Francisco Meet with MRSI Systems, Mycronic Group in San Francisco Booth #5405 MRSI will be sponsoring and attending SPIE Photonics West 2023.

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Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

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Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

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Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

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Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)

Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone

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Join MRSI Mycronic at the China International Optoelectronic Exposition (CIOE)

MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

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Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

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Advanced Patented Tool Change Turret from MRSI: Revolutionizing Precision Technology

MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

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MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging

MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation

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Mycronic on Allbright´s Green List

Mycronic on Allbright´s Green List We are proud to have been placed 19th on Allbright’s Green List, recognizing gender equality among Sweden’s publicly listed companies. This recognition is due

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MRSI宣布在中国深圳建立HVM3芯片贴装演示能力

MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。

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MRSI钱毅博士:5G时代自动化贴片系统的发展趋势

5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

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MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC

STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen

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MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

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MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

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MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer