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2023

NEW Automotive LiDAR: Photonics assembly requirements and trends, Limin Zhou, Avy Yi, MRSI

2022

VPT Components and MRSI Systems jointly address manufacturing challenges – Al Russo (VP of Engineering), VPT Components, Irving Wang and Jon Medernach, MRSI Systems

Top Interview with Compound-Semiconductor China - Dr. Limin Zhou MRSI (Mycronic Group) 2022

Top Interview with Compound Semiconductor China – Dr. Limin Zhou MRSI (Mycronic Group) 2022 (Chinese)

2021 


Automating RF PA Device Manufacturing as seen in Chip Scale Review March/April 2021

Automating RF PA Device Manufacturing (Chinese) as published inthe  March/April 2021 of Chip Scale Review 

Dr. Limin Zhou OFweek Interview 2021

Dr. Limin Zhou Interview with OFweek 2021 (Chinese)

Infostone Interview with MRSI Systems 2021 English

MRSI will build a new DEMO Center in Shenzhen China to support the rapid development of China’s photonics industry

Abstract: In this year’s Laser World of Photonics China(Shanghai), MRSI Systems continues to bring the most advanced 1.5 micron high-speed, high-precision, ultra-flexible automatic die bonder to provide on-site demonstration for domestic device manufacturers. The MRSI-H series die bonders are the industry’s proven solution for high-precision photonic production devices.

Infostone Interview with MRSI Systems 2021 (Chinese)

Interview with Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems (Video)

2020 

Assembly solution addresses TO-can photonic device manufacturing challenges  

 为5G无线网络中基于新型TO-can的光子器件提供具有最佳精确度的 创新装配自动化解决方案
An Innovative Assembly Automation Solution with the Best Accuracy for New TO-can Based Photonic Devices in 5G Wireless Network (Chinese Version)
 

Flexible high-volume die bonding solution targets modern photonics manufacturing

2019

Die-bonder innovations target HPLD manufacturing challenges

A Die Bonding Solution for Packaging High-Power Laser Diode Chips and Bars (Chinese Version)

应用于大功率激光器单管和Bar条芯片封装的贴片解决方案  

The most accurate high-volume and flexible die bonding solution for modern photonics manufacturing(Chinese Version)

Die-bonder-innovations-target-HPLD-manufacturing-challenges-Japanese

Challenges of photonics manufacturing in new data era (Chinese Version)

Challenges for photonics manufacturing in the new data center era  

2018

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions  

High-volume manufacturing (HVM) of chip-on-submount (CoS): challenges and solutions (Chinese Version)

Originally published in Chip Scale Review – July August 2017 Issue

2016

Advanced eutectic packaging for volume manufacturing of photonics, microwave and RF electronics

Advanced Eutectic Packaging for Volume Manufacturing of Photonics (Chinese Version)
Originally published in Chip Scale Review – July August 2016 Issue 适用于光子、微波及 RF 电子产品量产的先进共晶封装

Applying Automated Solutions to Photonics Manufacturing

Automating Military Hybrids and Microwave Module Assembly

High Precision Die Bonding for Photonics Packaging

Automating Hybrid Circuit Assembly

Automatic ChipPlacement: One Solution, User-Benefits and Future Development

Automated Techniques Improve Microwave-Module Assembly

Next-generation Electronics Packaging Using Flip Chip Technology.

Imaging Joins Robotics in Hybrid Assembly

Precision Epoxy Dispensing Combined with Traceability

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