Webinars

How to get the most out of your Mycronic placement process? With MYCenter Analysis, a new level of performance is in your hands.

Tired of seeing your AOI operators sanctioning false defects all day long? Discover Mycronic's strategy for fighting false defects and freeing up operator time while maintaining top reliability.

With the continuous electrification of everything, today's high-mix electronics manufacturers have to produce increasingly complex and varied boards, while maintaining a very high level of reliability. And all this in an often uncertain environment that requires even more agility to mitigate risks.

To ensure the robustness and durability of flip-package assemblies, electronics manufacturers have to apply an underfill process, which is one of the most challenging applications of fluid dispensing. Discover Mycronic’s expertise in this field and how our highly flexible dispensing technology helps you implement zero-defect underfilling.