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The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices
MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone
MRSI Systems – CIOE 2020 & IFOC 2020 Highlights
die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights CIOE was held from September 9-11, 2020, in a new location at the Shenzhen World Exhibition & Convention Center.
High-power Laser Diode Manufacturing Challenges
This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:
MRSI solves one of the greatest challenges in modern photonics manufacturing
MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.
Visit MRSI at SPIE Photonics West 2022
Meet with MRSI Systems in San Francisco
Visit MRSI at IMAPS Device Packaging in Arizona
MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.
Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system
During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the
MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local
Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications
There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.
MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.
MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting
On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.
Visit MRSI Systems at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541
Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.
MRSI Systems’ Customer Support – Peter Cronin
Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.
International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo
IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.
Technical articles archive
Download articles from MRSI systems and read about how we are changing the die bonding industry.
What is the Future of Optoelectronics Packaging?
Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.
Case story: Going beyond with HONOR
Skating fast Case story: Going beyond with HONOR The tempo of business in China is lightning fast. But if you are responsive and go a step beyond, the rewards can be great, as the Assembly
Innovation thrives when staff is allowed to reach their full potential
Learn how Mycronic’s CEO Anders Lindqvist fosters a culture of innovation and collaboration among his engineers, who create cutting-edge electronics solutions for customers worldwide.
Striving to become the most trusted partner
Mycronic is creating production solutions for the electronics industries. Discover how our solutions help turning countless innovations into reality every day.
The next big thing is happening today
Naturally there are many trends impacting the future of the electronics industry. These include personalization, digitalization, miniaturization, Industry 4.0, the Internet of Things and Big
5G technology fuels connectivity and innovation
5G technology, with 100 times faster speeds than 4G, opens up new possibilities for consumers and businesses. And it’s already placing tough demands on manufacturers as well!
AI is the secret weapon for higher productivity
AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.
Growth of edge computing gives birth to regional data centers
Edge computing brings data storage and processing closer to the source of data. Learn how Mycronic supports edge computing with flexible systems and specialized solutions.
The trend towards a climate neutral electronics sector
Discover how Mycronic’s innovative products, such as the SLX mask writer, can help the electronics sector achieve climate neutrality by saving energy and reducing waste.
Mycronic welcomes Huan Cheng Xin to the Group
Mycronic welcomes Huan Cheng Xin to the Group Mycronic welcomes Huan Cheng Xin to the Group On November 1, 2021, a closing ceremony was held between Mycronic and Huan Cheng Xin Precision
Interim Report Q1 2023
Interim Report Q1 2023 Interim Report Q1 2023 Presentation of Mycronic's Q1 report January-March 2023 Interim report January-March 2023 Presentation Q1 report