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MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

Increasing demand for high-volume manufacturing accelerates the continuing adaptation of full automation in advanced eutectic packaging.

Learn more about how VPT Components and MRSI Systems jointly address manufacturing challenges.

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

This case study explains how MRSI achieved high throughput for high volume high mix production with flexible high volume high precision using their latest die bonding systems.

MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

Ezer Espares has over 25 years of experience in semiconductor packaging, testing, and equipment support, including installations and customer support.

Find the MRSI Systems Press Releases Archives here. Here you will be able to access all of the documents at which you may need to take a look.

2021年9月27日，由 Laser Focus World 主办的“2021年度创新大奖”评选落下帷幕，MRSI Systems(Mycronic Group)凭借MRSI-H-TO 1.5微米贴片机系列产品荣膺银奖，该奖项为生产设备类的最高奖。

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

MRSI Systems（Mycronic Group）很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作，并作为中国区销售代表服务市场，工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心，该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

Vanguard Automation GmbH Gablonzer Strasse 10 76185 Karlsruhe Germany +49 721 5966 063 – 0 https://maps.app.goo.gl/8C44wc9j6zrRtUgZ9

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference