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波士顿联邦法院首席法官驳回了Palomar对MRSI涉嫌涵盖制造过程的“double pick”专利侵权指控的主张；法院裁定声称的该方法“非常基础，已被人类了解数千年。”国际律师事务所Crowell＆Moring LLP代表领先的精密制造商MRSI Systems；MRSI将向Palomar索取全额律师费。

MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from

摘要：MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖，代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

MRSI Systems（Mycronic Group）很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作，并作为中国区销售代表服务市场，工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

Learn more about Silicon Photonics from MRSI Systems who is a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our