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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen

We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,

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The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available

MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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MRSI Mycronic to Present at Automotive LIDAR 2022

Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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MRSI to present and attend 4th LiDAR Tech 2022

MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications

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MRSI to exhibit at the European Microwave Week in Milan

MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in

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MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions

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Visit MRSI at ECOC in Basel, Switzerland

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

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Hybrid Electronics Technology for Printed Lighting

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

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MRSI Systems’ Sales Team – Jon Medernach

Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.

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IMS 2019 Boston

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

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2017 International Microwave Symposium Highlights

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.

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Presentation year-end report 2022

Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December 2022 Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December

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Presentation year-end report 2023

Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023   Watch the presentation here  

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Interim Report Q3 2023

Interim Report Q3 2023 Presentation of Mycronic's interim report January-September 2023 Interim report January-September 2023 Presentation Q3 report

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Interim report Q2 2023

Interim Report Q2 2023 Presentation of Mycronic's interim report January-June 2023 Interim report January-June 2023 Presentation Q2 report

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Whistleblower policy

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic strives to maintain an open business climate and to uphold high ethical standards. To identify and manage risks early,

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Diversity, equity & inclusion policy

ID: 80401 | Version: 2 | Published: April 12, 2023 Mycronic group diversity, equity and inclusion policy Mycronic is committed to ensuring and cultivating a diverse, equitable and inclusive

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Quality & environmental policy

ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We

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Anti-corruption policy

ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and

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Technical articles archive

Download articles from MRSI systems and read about how we are changing the die bonding industry.

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新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024

MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from

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MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China

MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against

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MRSI-S-HVM亚微米贴片机荣获“讯石2020年度光通信最具竞争力产品”

摘要:MRSI Systems, Mycronic Group的MRSI-S-HVM亚微米贴片机荣获“2020年度光通信最具竞争力产品”奖,代表了MRSI-S-HVM亚微米贴片机?获得行业专家评审团的一致认可与高度评价。

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MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging

MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation

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MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

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MRSI launches new die bonders with improved accuracy

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and