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At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

Learn more about photonics bonding from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.

Learn more about MRSI's training services including on-site training and software training videos. Contact Us.

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Meet with our experienced Applications Engineers to learn more about how to develop and design processes. We can also help to test the process for you on our industry-leading die bonders.

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

Mycronic headquarter in Täby, Stockholm, Sweden Interview with new Mycronic CEO Anders Lindqvist Innovation is our rocket fuel A TRUE INTERNATIONALIST WITH A GLOBAL TRACK RECORD of growing

Tekniksprånget 2020 Tekniksprånget 2020 An internship that takes the leap into technology The Swedish initiative Tekniksprånget (Technology Leap) is a four-month paid internship program

Offset with global trends, skyscrape to help our customers stay at the forefront of the electronics industry Keeping up with global trends Regionalization, digitalization, automation and

Mycronic joins United Nations Global Compact Mycronic joins United Nations Global Compact Sustainability is a key element of Mycronic’s business strategy and we are continuously working to

Discover how Mycronic’s innovative products, such as the SLX mask writer, can help the electronics sector achieve climate neutrality by saving energy and reducing waste.

Mycronic welcomes Huan Cheng Xin to the Group Mycronic welcomes Huan Cheng Xin to the Group On November 1, 2021, a closing ceremony was held between Mycronic and Huan Cheng Xin Precision

Mycronic Vietnam Mycronic in Vietnam Axxon (Vietnam) Automation Co. Ltd 4th Floor Bac Ninh Mitsubishi tower, Le Thai To road, Vo Cuong Ward 16000 Bac Ninh Bac Ninh city Vietnam +84 917681710

Axxon China Mycronic, Shenzhen Axxon Shenzhen Axxon Automation Co., Ltd A14 Building, Silicon Valley Power Automotive Innovation Park Guanlan Guiyue Road No.334 , 518110 Long Hua district,

Mycronic Benelux Mycronic, Netherlands, Eindhoven Mycronic B.V. Kerkhofstraat 21 554 HG Valkenswaard NL8093 88315 B01 Netherlands 31 402 62 06 67 +31 402 62 06 68 Mycronic B.V." "Kerkhofstraat