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MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen

5G时代的到来势不可挡，而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下， 作为全球光电器件自动化贴片封装设备的领军企业， MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上，MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。

MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,

MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip