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Large area measurement
Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other
Improve pick and place machine utilization by keeping dies in their places
die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of
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Thank you for contacting us regarding photomask equipment
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Mycronic Mexico
Mycronic Mexico Mycronic in Plaza Epicentra, San Juan de Ocotan, Mexico Carretera Guadalajara-Tepic No. 7355 – 308 Plaza Epicentra Z.C. 45019 San Juan de Ocotan Zapopan, Jalisco Mexico Carr.
US Application Center
US Application Center 1450 Koll Circle 95112 San Jose CA USA Yes, please contact me
Axxon Europe B.V.
Axxon Europe B.V. High Tech Campus 10 5656 AE Eindhoven Netherlands Yes, please contact me
News
photomask-equipment Read our latest news here.
IEEE Photonics Devices
The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.
Multiple Die Eutectic Bonding
Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.
How to Choose a Die Bonding System
Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems
Epoxy Deposition – Requirement for High-Volume Manufacturing (HVM) of Chip-on-Submount (CoS)
Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.
MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
Dr. Limin Zhou to present at the 22nd Infostone Optical Communication and Market Technology Conference (IFOC 2024)
Mark your calendars for September 9-10, 2024, at the InterContinental Hotel of the Shenzhen World Exhibition and Convention Center in Shenzhen, China, which hosts the highly anticipated Infostone
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)
Case stories
Case stories Z-AXIS has seen clear results across its production lines with every Mycronic equipment upgrade. From rapid prototyping to ramp-up production: inside DSP’s integrated SMT setup FDI
MRSI Mycronic to Showcase Advanced Assembly Solutions for High Volume Photonics Manufacturing at CIOE 2024
MRSI Mycronic, a part of the Mycronic Group, will be exhibiting and presenting innovative advanced assembly solutions at the 24th China International Optoelectronic Exposition (CIOE) from
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
MRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against
MRSI Mycronic introduces next generation high precision epoxy dispenser for advanced packaging
MRSI Mycronic a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding, active alignment, and epoxy dispensing systems, proudly introduces the next generation
MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA
die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of
MRSI Mycronic Opens New Demo Center in Shenzhen, China
MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of
Epoxy Die Bonding of Ultra Small Ceramic Capacitors
As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One
Optoelectronics Packaging
MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies
How to Choose an Epoxy Dispenser
When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and
MRSI’s heated head die bonder targets High-Density Photonic Devices
The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.
MRSI Systems is excited to launch our free software training video program!
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our
Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?
Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding
Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology
We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference
MRSI to Exhibit at NEPCON Thailand
We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.