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atg Mycronic GmbH (HQ) atg Mycronic GmbH New Building atg Mycronic GmbH Karl-Carstens-Straße 19 97877 Wertheim Germany +49 9342 291 0 (Reception), +49 9342 291 420 (Service department)

atg Mycronic, part of Mycronic Inc. Mycronic, USA, Tewksbury atg Mycronic USA 554 Clark Road 01876 Tewksbury, MA USA +1 909 374 1302 Mycronic, 554 Clark Road, Tewksbury, MA 01876

atg Mycronic Asia, Ltd. Mycronic, Taiwan, Taoyuan City atg Mycronic Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, China Taiwan Taiwan +886 3 4628500 Mycronic,

Find customer support information from MRSI Systems, how we can help you and how we go the extra mile to support our customers.

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Meet with our experienced Applications Engineers to learn more about how to develop and design processes. We can also help to test the process for you on our industry-leading die bonders.

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Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.

Learn more about photonics bonding from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Learn more about Silicon Photonics from MRSI Systems who is a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.

Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery

die-bonding

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering

MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,

MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and