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Supplier Code of Conduct
ID: 80370 | Version: 4 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct The purpose of this Supplier Code of Conduct (“SCoC”) is to outline the minimum ethical standards and
Diversity, equity & inclusion policy
ID: 80401 | Version: 2 | Published: April 12, 2023 Mycronic group diversity, equity and inclusion policy Mycronic is committed to ensuring and cultivating a diverse, equitable and inclusive
Quality & environmental policy
ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We
Anti-corruption policy
ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and
Distributor Code of Conduct
ID: 80225 | Version: 5 | Published: September 11, 2024 Mycronic Group Distributor Code of Conduct The purpose of this Distributor Code of Conduct (“DCoC”) is to outline the minimum ethical
Code of Conduct
Mycronic Group Code of Conduct ID: 80381 | Version: 6 | Published: May 15, 2025 | Approved at board meeting 2025-05-07 Mycronic Group Code of Conduct The Mycronic Group Code of Conduct represents
Presentation year-end report 2022
Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December 2022 Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December
Presentation year-end report 2023
Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023 Watch the presentation here
Interim Report Q3 2023
Interim Report Q3 2023 Presentation of Mycronic's interim report January-September 2023 Interim report January-September 2023 Presentation Q3 report
Interim report Q2 2023
Interim Report Q2 2023 Presentation of Mycronic's interim report January-June 2023 Interim report January-June 2023 Presentation Q2 report
Silicon Photonics
Learn more about Silicon Photonics from MRSI Systems who is a leading supplier to manufacturers of advanced optical assembly for over 40 years.
RF Power Amplifier & Microwave Device
Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.
Photonics
Learn more about photonics bonding from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Microelectronics
MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.
LIDAR, AR/VR/MR
Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Microwave & RF
Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.
High Power Laser Diodes
Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Wafer Level Packaging
Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.
Processes
Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding
Sensors
The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &
Die bonding
Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.
Eutectic die bonding
Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.
Epoxy die bonding
Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.
Gallery
Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery
Events
die-bonding
MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN
BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material
MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)
The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology
The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and