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Building Complex Hybrid Circuits-Advanced Packaging

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically

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Flexible Automation Solutions to Accelerate LiDAR Automotive Applications

LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used

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Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform

The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of

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Hybrid Electronics Technology for Printed Lighting

die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam

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2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights

die-bonding 2017 Optical Fiber Communication Conference and Exhibition (OFC) Highlights MRSI Systems is a frequent participant at OFC. OFC gave us an opportunity to meet with our customers and

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MRSI Systems’ Sales Team – Jon Medernach

Jon is a strong proponent of relationship selling and believes in the importance of customer advocacy within MRSI by providing the customer a voice.

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iMAPS New England 44th Symposium and Expo: “The Jetsons 2017”

The International Microelectronics Assembly and Packaging Society New England Chapter’s Symposium will be held in Boxborough, MA on May 2nd, 2017.

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MRSI Participated in the 2017 Electronic Components and Technology Conference(ECTC)

“MRSI Systems was glad to exhibit at the Technology Corner, attend the technical conference, and meet customers at ECTC this year again."

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ECTC – The 67th Electronic Components and Technology Conference

MRSI Systems is exhibiting at the 67th ECTC focused on the global microelectronics packaging industry.

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Supplier Code of Conduct for Service Providers and non-critical Suppliers

ID: 80566 | Version: 3 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct for Service providers and non-critical Suppliers The purpose of this Supplier Code of Conduct for Service

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Whistleblower policy

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic strives to maintain an open business climate and to uphold high ethical standards. To identify and manage risks early,

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Distributor Code of Conduct

ID: 80225 | Version: 5 | Published: September 11, 2024 Mycronic Group Distributor Code of Conduct The purpose of this Distributor Code of Conduct (“DCoC”) is to outline the minimum ethical

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Supplier Code of Conduct

ID: 80370 | Version: 4 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct The purpose of this Supplier Code of Conduct (“SCoC”) is to outline the minimum ethical standards and

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Diversity, equity & inclusion policy

ID: 80401 | Version: 2 | Published: April 12, 2023 Mycronic group diversity, equity and inclusion policy Mycronic is committed to ensuring and cultivating a diverse, equitable and inclusive

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Code of Conduct

Mycronic Group Code of Conduct ID: 80381 | Version: 6 | Published: May 15, 2025 | Approved at board meeting 2025-05-07 Mycronic Group Code of Conduct The Mycronic Group Code of Conduct represents

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Quality & environmental policy

ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We

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Anti-corruption policy

ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and

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Photonics Manufacturing for the Hyperscale Data Center Era

This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond:

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MRSI Systems Launches New Software Video Training Programs

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

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MRSI Systems’ Dr. Yi Qian: The Latest Solution for Automated Manufacturing of Optoelectronic Devices in the 5G Era

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

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MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

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MRSI Shenzhen Demo Center grand opening ceremony

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

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Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications

There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high

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International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018

MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.

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Optical Fiber Conference and Exposition (OFC) 2018 – San Diego

The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.

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MRSI Systems’ Customer Support – Peter Cronin

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

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International Microelectronics Assembly and Packaging Society New England 45th Symposium & Expo

IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.

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Technical articles archive

Download articles from MRSI systems and read about how we are changing the die bonding industry.

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MRSI Systems Provides MRSI-M3 Die Bonding Assembly Work Cell to Fabrinet in Silicon Valley for Fast Prototyping and New Product Introduction

North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

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MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN

BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material