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We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

MRSI’s latest article in Chip Scale Review discusses the similarities and differences between automotive light detection and ranging (LiDAR) and optical transceivers are compared.

MRSI has recently launched the 705HF die bonder, which is designed to cater to the requirements of power devices and advanced chip packaging. The machine is equipped with a heated bond head that

Join us at the 6th annual Automotive LIDAR conference and exhibition from October 3-5, 2023. This conference is the only event in the world exclusively focused on automotive LIDAR technologies

MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.

MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and