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Supplier Code of Conduct

ID: 80370 | Version: 4 | Published: May 08, 2025 Mycronic group Supplier Code of Conduct The purpose of this Supplier Code of Conduct (“SCoC”) is to outline the minimum ethical standards and

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Diversity, equity & inclusion policy

ID: 80401 | Version: 2 | Published: April 12, 2023 Mycronic group diversity, equity and inclusion policy Mycronic is committed to ensuring and cultivating a diverse, equitable and inclusive

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Quality & environmental policy

ID: 80018 | Version: 2 | Published: 2024-05-02 Mycronic group quality and environmental policy Mycronic’s vision is to be the most trusted partner to the creators of tomorrow’s electronics. We

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Anti-corruption policy

ID: 80214 | Version: 5 | Published May 08, 2025 Mycronic group anti-corruption policy The purpose of this Anti-Corruption Policy (the “Policy”) is to clarify the rules applied by Mycronic AB and

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Distributor Code of Conduct

ID: 80225 | Version: 5 | Published: September 11, 2024 Mycronic Group Distributor Code of Conduct The purpose of this Distributor Code of Conduct (“DCoC”) is to outline the minimum ethical

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Code of Conduct

Mycronic Group Code of Conduct ID: 80381 | Version: 6 | Published: May 15, 2025 | Approved at board meeting 2025-05-07 Mycronic Group Code of Conduct The Mycronic Group Code of Conduct represents

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Presentation year-end report 2022

Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December 2022 Presentation year-end report 2022 Presentation of Mycronic's year-end report January-December

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Presentation year-end report 2023

Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023   Watch the presentation here  

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Interim Report Q3 2023

Interim Report Q3 2023 Presentation of Mycronic's interim report January-September 2023 Interim report January-September 2023 Presentation Q3 report

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Interim report Q2 2023

Interim Report Q2 2023 Presentation of Mycronic's interim report January-June 2023 Interim report January-June 2023 Presentation Q2 report

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Silicon Photonics

Learn more about Silicon Photonics from MRSI Systems who is a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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RF Power Amplifier & Microwave Device

Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.

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Photonics

Learn more about photonics bonding from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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Microelectronics

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

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LIDAR, AR/VR/MR

Learn more about LiDAR, AR/VR/MR from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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Microwave & RF

Microwave and RF packages from MRSI Systems who has been a leading supplier of High Frequency, Ultra High Frequency components for over 40 years.

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High Power Laser Diodes

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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Wafer Level Packaging

Explore the transformative potential of wafer-level packaging in microelectronics and learn how this cost-effective solution enhances performance, reliability, and versatility across industries.

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Processes

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

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Sensors

The photonics sensor and detectors market is growing rapidly, which encourages application of photonics sensor technology into several industries areas such as manufacturing, defense &

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Die bonding

Die bonding is as old as the semiconductor industry itself. From the onset, integrated circuits or ICs were developed using four levels of interconnections.

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Eutectic die bonding

Eutectic die bonding, sometimes referred to as eutectic die attach, is a die bonding technique used for devices that require enhanced heat dissipation.

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Epoxy die bonding

Epoxy die bonding, sometimes referred to as epoxy die attach, is the most widely used die bonding technique in semiconductor assembly.

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Gallery

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery

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Events

die-bonding

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MRSI Systems offers In-Line Eutectic for Direct Eutectic or Solder Reflow for GaAs & GaN

BILLERICA, MA — August 12, 2015 — MRSI Systems, a developer and manufacturer of turnkey die bonding and dispensing systems, announced today the introduction of a new automated in-line material

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MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC

STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen

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Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

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Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and