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MRSI is proud to be exhibiting and presenting at the 25th China International Optoelectronic Exposition this year in Shenzhen. Stop by our booth #10B79 to learn more about how MRSI products meet

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.

The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,

MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,