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Come visit us at the International Microwave Symposium

Join us in our booth at the Denver, Colorado IMS event this month to talk with us and build connections! We will be more than happy to discuss the current products our company has to offer.

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Visit MRSI at SPIE Photonics West 2022

Meet with MRSI Systems in San Francisco

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MRSI to present at LaserFocusCon 2022

We are pleased to announce that MRSI will be exhibiting at this year’s LaserFocusCon in Suzhou, China on August 30th. Dr. Limin Zhou, Senior Director, Strategic Marketing, MRSI Systems, Mycronic

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Visit MRSI at IMAPS Device Packaging in Arizona

MRSI is attending and sponsoring the 18th Annual IMAPS Device Packaging Conference and Exhibition.

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Visit MRSI at ECTC in San Diego

MRSI Systems is exhibiting at the IEEE 72nd Electronics Components and Technology Conference from June 1-3, 2022 in San Diego, CA. Stop by the MRSI Booth #613 to learn how we can help solve your

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ECTC San Diego 2022 Highlights

The 2022 Electronics Components and Technology Conference in San Diego was a tremendous success. We would like to thank everyone who attended the conference and to those who stopped by our booth

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What is the Future of Optoelectronics Packaging?

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

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MRSI Systems 荣获“2021 Laser Focus World创新大奖”

2021年9月27日,由 Laser Focus World 主办的“2021年度创新大奖”评选落下帷幕,MRSI Systems(Mycronic Group)凭借MRSI-H-TO 1.5微米贴片机系列产品荣膺银奖,该奖项为生产设备类的最高奖。

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MRSI Systems,迈康尼集团宣布与Lumentum达成新合作,将为汽车行业提供创新的激光雷达解决方案

MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum",纳斯达克代码:LITE),Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。

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MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

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MRSI,Mycronic中国深圳新的产品演示中心正式成立

MRSI Systems(Mycronic Group)目前已经在中国深圳正式创建了新的产品演示中心,该产品演示中心落成于深圳市南山区朗山路华瀚创新园。

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MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

die-bonding MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder MRSI Systems (Mycronic Group), a

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MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA

die-bonding MRSI to exhibit with live demonstrations and present at LASER World of PHOTONICS CHINA We are pleased to announce that MRSI, Mycronic Group will be exhibiting at LASER World of

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MRSI launches new die bonders with improved accuracy

die-bonding MRSI launches new die bonders with improved accuracy MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and

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MRSI’s capabilities in fluxless Au/Sn soldering applications

Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering

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Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

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Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

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Join us in Denmark!

MRSI is thrilled to announce our participation at the ECOC Exhibition in Copenhagen, Denmark, taking place from September 29 to October 1, 2025. As a global leader in advanced packaging solutions,

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Join Us at the IMAPS Symposium

MRSI is pleased to announce our participation as an exhibitor at the upcoming 58th International Symposium on Microelectronics is organized by the International Microelectronics Assembly and

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MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"

On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical

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MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

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Join MRSI Mycronic at IMAPS New England in May!

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May

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MRSI Support for Application Specific Pickup Tip Designs

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

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MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

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What is the significance of co-planarity in die bonding?

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

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Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

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Mastering the Art of Handling Delicate High Aspect Ratio Dies: Challenges and Solutions

Handling delicate, large aspect ratio, and thin dies is essential across various applications, including RF Power, Optical, and MEMS. These devices have aspect ratios exceeding 45 to 1,

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MRSI to Exhibit at NEPCON Thailand

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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Explore Innovations in Optics and Photonics at SPIE Photonics West 2025

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

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MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision