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MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"
On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical
MRSI’s capabilities in fluxless Au/Sn soldering applications
Fluxless soldering, especially with 80/20 Au/Sn ribbon and preforms, is a critical process in advanced electronic packaging where reliability and cleanliness are paramount. While soldering
MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing
Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,
Join MRSI Mycronic at IMAPS New England in May!
die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May
MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit
In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design
What is the significance of co-planarity in die bonding?
At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.
Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology
We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference
MRSI to Exhibit at NEPCON Thailand
We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.
Explore Innovations in Optics and Photonics at SPIE Photonics West 2025
Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the
MRSI Systems (Mycronic Group) 应邀出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲
摘要:(第三届)激光雷达前瞻技术展示交流会于2021年12月14日-12月15日在江苏苏州举办。MRSI Systems战略市场高级总监,周利民博士出席2021(第三届)激光雷达前瞻技术展示交流会并发表“车载激光雷达光器件封装的挑战与解决方案”的演讲。
MRSI Shenzhen Demo Center grand opening ceremony
On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local
MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium
MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.
MRSI Systems最新1.5μm系列产品荣获“中国光电博览奖”银奖
摘要:由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“,MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评,成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域,广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件,以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /
MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four
MRSI Systems received the 2021 CIOE Silver Award for the MRSI-HVM Die Bonder
MRSI Systems won the China Optoelectronics Expo Award (CIOE Award) for the latest MRSI-HVM 1.5 micron series of products. The MRSI-HVM with conveyor is an outstanding innovation, widely used in
The Versatile MRSI-HVM
2021 was a great year for our best-selling product, the MRSI-HVM 1.5 micron high-speed die bonder. This system meets the needs of many industries from telecom, datacom and medical devices
MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)
Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone
Visit MRSI at SPIE Photonics West 2022
Meet with MRSI Systems in San Francisco
MRSI钱毅博士:5G时代自动化贴片系统的发展趋势
5G时代的到来势不可挡,而这一趋势也不断对芯片的贴片、封装工艺提出新的要求。在此背景下, 作为全球光电器件自动化贴片封装设备的领军企业, MRSI Systems也适时推出了新产品、新技术。在今年9月的深圳光博会上,MRSI的产品管理和市场营销副总裁钱毅博士向OFweek光通讯网介绍了MRSI的产品、研发优势及未来的市场趋势。
MRSI Systems赢得长期诉讼, Palomar的 “Double Pick” 专利权被判无效
波士顿联邦法院首席法官驳回了Palomar对MRSI涉嫌涵盖制造过程的“double pick”专利侵权指控的主张;法院裁定声称的该方法“非常基础,已被人类了解数千年。”国际律师事务所Crowell&Moring LLP代表领先的精密制造商MRSI Systems;MRSI将向Palomar索取全额律师费。
MRSI to present at IFOC and attend CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications (IFOC) Conference, organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from
MRSI improves accuracy to 1.5 micrometers for MRSI-H/HVM-Series die bonders
MRSI Systems (Mycronic Group) is pleased to announce the latest advancement in the MRSI-H/HVM-series product line. Placement accuracy was tested using industry-standard glass die reference
MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监
MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。
MRSI Systems welcomes Hendry He as China Country Sales Director
MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is
MRSI receives Laser Focus World Innovators Award for HVM die bonder
MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元
MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L
MRSI Systems 荣获“2021 Laser Focus World创新大奖”
2021年9月27日,由 Laser Focus World 主办的“2021年度创新大奖”评选落下帷幕,MRSI Systems(Mycronic Group)凭借MRSI-H-TO 1.5微米贴片机系列产品荣膺银奖,该奖项为生产设备类的最高奖。
MRSI Systems,迈康尼集团宣布与Lumentum达成新合作,将为汽车行业提供创新的激光雷达解决方案
MRSI Systems很高兴地宣布与Lumentum达成新合作("Lumentum",纳斯达克代码:LITE),Lumentum是汽车行业光子芯片和光模块的全球领导者。此次合作有望为该行业带来创新的激光雷达解决方案。