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atg Mycronic Asia, Ltd.

atg Mycronic Asia, Ltd. Mycronic, Taiwan, Taoyuan City atg Mycronic Asia Ltd. 4F., No. 136, Changchun 2nd Rd., Zhongli Dist., Taoyuan City 320, China Taiwan Taiwan +886 3 4628500 Mycronic,

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Applications

Learn more about MRSI Systems Applications including Microelectronics, Microwave & RF as well as Photonics and Sensors.

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RF Power Amplifier & Microwave Device

Learn more about RF Power Amplifiers and Microwave Device from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 4o years.

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Gallery

Gallery Video gallery Image gallery MRSI Die Bonding Video MRSI Patented Turret MRSI Die Bonding Gallery

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Events

die-bonding

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IEEE Photonics Devices

The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications. Watch the Webinar Recording.

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MRSI Mycronic | MRSI-LEAP High-Speed Die Bonder Receives "Optical Communication Innovation Product Award" at CFCF2025

MRSI Mycronic received the "Optical Communication Innovation Product Award" at the CFCF2025 Optical Connectivity Conference. Our MRSI-LEAP High-Speed die bonder was recognized for its precision

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MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing

Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,

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Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)

The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition

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Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology

The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and

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Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology

We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference

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MRSI to Exhibit at NEPCON Thailand

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

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Optoelectronics Packaging

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

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How to Choose an Epoxy Dispenser

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

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MRSI’s heated head die bonder targets High-Density Photonic Devices

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

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MRSI Systems is excited to launch our free software training video program!

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our

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Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding – But so What?

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

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Join MRSI Systems at IMAPS Device Packaging Conference this spring!

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

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Two ways our MRSI Systems Machines offer efficiency and productivity to our customers

Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and

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MRSI to sponsor and present at IMAPS New England this May

die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along

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An update on our free software training video program

Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to

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Improve pick and place machine utilization by keeping dies in their places

die-bonding Improve pick and place machine utilization by keeping dies in their places A lot of dies are presented to die bonders in waffle packs and there is a common issue of component out of

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Interview with MRSI: Accuracy is improved to 1.5 microns to meet the 5G and 400G high-speed interconnection era of optical device automated placement solution system

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

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MRSI Shenzhen Demo Center grand opening ceremony

On August 8, 2021, MRSI Systems(Mycronic Group) held the grand opening of its Product Demonstration Center in Shenzhen, China. The opening ceremony was accompanied with a speech by local

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MRSI to Sponsor and Exhibit at the International Microelectronics Assembly and Packaging Society (IMAPS) Symposium

MRSI (Mycronic Group) is exhibiting at the 54th International Symposium on Microelectronics from October 11-14, 2021, in San Diego, California at the Town and Country Resort.

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MRSI Systems最新1.5μm系列产品荣获“中国光电博览奖”银奖

摘要:由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“,MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评,成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域,广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件,以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

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Die bonding solution targets modern photonics manufacturing – building bricks for 5G rollout

5G continues to drive the needs of the Datacom supply chain which presents challenges to photonic device manufacturers. In this article featured in Laser Focus World, MRSI highlights the

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MRSI will exhibit and present at the Automotive LIDAR 2020 Virtual Conference and Exhibition

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

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MRSI presented at the 20th Infostone Optical Communication Market and Technology Conference (IFOC)

Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI Systems presented “Integrated Photonics Devices Volume Manufacturing Challenges & Innovative Solutions” at the 20th Infostone

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MRSI Systems – CIOE 2020 & IFOC 2020 Highlights

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights CIOE was held from September 9-11, 2020, in a new location at the Shenzhen World Exhibition & Convention Center.