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MRSI opens a new Product Demo Center in China, will present at the Infostone Conference and attend CIOE with live demos
MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI
MRSI Systems 宣布“DIE PLACEMENT HEAD WITH TURRET” (集成水平转塔之芯片贴装头)已获得中国专利授权
MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布,中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH
MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer
MRSI推出升级版MRSI-705贴片机 助力大批量制造
ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China
STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,
Join us at the upcoming events!
MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product
Meet the MRSI-705: Your Essential Tool for Precision and Reliability in Critical Applications
The MRSI-705 has established itself as a reliable tool in the aerospace, defense, and medical industries, playing a crucial role in mission-critical tasks due to its performance, adaptability,
Exploring Automotive LiDAR Packaging Trends
In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels
MRSI Mycronic to Present at the 7th Annual Automotive LIDAR Conference
MRSI Mycronic is proud to sponsor the 7th Annual Automotive LIDAR Conference, taking place online from November 20-21, 2024.
Dr. Limin Zhou to present at the Semiconductor Advanced Technology Innovation Development and Opportunities Conference
The rapid adoption of artificial intelligence is driving advancements in optical interconnect technology, resulting in notable improvements in speed, power efficiency, and cost reduction. This
Innovation Continues on MRSI-705HF
Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.
Challenges and Solutions in the Photonics Packaging Industry
This increased demand for photonics components is driven by the growth in optical networks. Learn more about Photonics Packaging by reading more from MRSI Systems!
MRSI-175Ag – A flexible epoxy dispensing solution
The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,
MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL
Software Video Training Programs for Die Bonding and Epoxy Dispense Systems
These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.
Join MRSI at the China International Optoelectronic Conference (CIOE)
At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment
Advancing automation: unleashing the power of the automatic tool changing turret
In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented
MRSI New Solution: Tape Holder
If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips
Produktområden
Produktområden Kretskortsmontering Fotomaskritare Dispensering och lackering Testsystem för mönsterkort Die bonding Photonics Interconnects Magnetic Test Kretskortsmontering
Axxon
Axxon Mycronic creates coating systems Axxon Mycronic is a leading, global supplier of innovative and production-ready, dispense and conformal coating systems. Expertly designed for to perform in
Mycronic erhåller order på två SLX-maskritare
Mycronic AB (publ) har erhållit en order på två SLX-maskritare från en ny kund i Asien. Ordervärdet ligger i intervallet 13-15 MUSD. Det första systemet är planerat
Hållbara lösningar
As a global supplier of production equipment to the electronics industry, act responsibly As a global supplier of production equipment to the electronics industry, Mycronic acts responsibly
Certifikat
Certifikat På Mycronic är vi engagerade i att arbeta systematiskt, konsekvent och effektivt för att uppnå våra mål och skapa värde för våra kunder och
Aktieinformation
Aktieinformation
Kommuniké från årsstämma och konstituerande styrelsemöte i Mycronic AB (publ)
Årsstämman i Mycronic AB (publ) hölls den 8 maj 2024. Stämman genomfördes med fysisk närvaro av aktieägare och ombud. Inför stämman gavs även möjlighet
Delårsrapport januari-september 2024
Delårsrapport januari-september 2024 Tredje kvartalet Orderingången uppgick till 1 459 (1 467) MSEK, en minskning med 1 procent Nettoomsättningen ökade med 40 procent till 1 780
Mycronics vetenskapsbaserade klimatmål godkända
Organisationen Science Based Targets initiative har godkänt Mycronic AB (publ) två mål för minskning av utsläpp. Godkännandet markerar en milstolpe i företagets
Mycronic genomför aktiesplit och fastställer avstämningsdag
Årsstämman i Mycronic AB (publ) den 7 maj 2025 beslutade om en uppdelning av bolagets aktier, s.k. aktiesplit, varvid en (1) befintlig aktie delas i två (2) aktier. Årsstämman
Mycronic erhåller order på en Prexision Lite 8 Evo
Mycronic AB (publ) har erhållit en inbytesorder på en Prexision Lite 8 Evo från en befintlig kund i Asien. Ordervärdet ligger i intervallet 8-10 MUSD. Systemet är planerat