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International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.
MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting
On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.
Visit MRSI Systems at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541
Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing
Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps
High Volume Manufacturing of Photonic Components and Modules
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...
MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable
MRSI to present at the 21st Infostone Optical Communication Market and Technology Conference
MRSI will be presenting at the Infostone Optical Communication Market and Technology Conference which will be held at the Hyatt Regency Shenzhen Airport Hotel in Shenzhen, China from September
MRSI Systems is excited to launch our free software training video program!
MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems. MRSI wants the acquisition of our
Join MRSI at IMS in San Diego
The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,
Join MRSI Systems at IMAPS Device Packaging Conference this spring!
Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th
Two ways our MRSI Systems Machines offer efficiency and productivity to our customers
Jack Inocencio, the Sr. Manager of Applications and Service, extended some conducive knowledge on why MRSI System’s products will accelerate photonics manufacturers’ efficiency and
MRSI to sponsor and present at IMAPS New England this May
die-bonding MRSI to sponsor and present at IMAPS New England this May MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along
Join MRSI at ECOC 2023 – The European Conference on Optical Communication
MRSI is excited to announce we will be exhibiting at the 49th exhibition of ECOC in Glasgow, Scotland from October 2-4, 2023.
Dr. Limin Zhou to present at the CHIP China Conference
Dr. Limin Zhou, General Manager, MRSI Automation (Shenzhen) Co., Ltd., Senior Director of Strategic Marketing, MRSI Systems will present “Discussion on New Challenges and Solutions of Chip
Learn why the MRSI-705 is an industry leader in flexibility and reliability
The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.
An update on our free software training video program
Our launch of our free software training outlined the cadence of how 1 training video would be released a week. Since then, we are proud to announce we have released five new videos with more to
Multiple Die Eutectic Bonding
Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.
MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Conference (CIOE) in Shenzhen
We are proud to announce that MRSI will be exhibiting at this year’s 24th China International Optoelectronic Exposition. This event will be held from September 7-9th (Postponed to September 6-8,
The Japanese version of MRSI’s article “Die-bonder innovations target HPLD manufacturing challenges” is now available
MRSI’s article in Laser Focus World’s February 2020 Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)
Join us at IMAPS in Boston!
MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,
MRSI Mycronic to Present at Automotive LIDAR 2022
Join us at the 5th annual Automotive LIDAR conference and exhibition from September 20-22nd. Automotive LIDAR is the only conference to be primarily focused on automotive LIDAR technologies and
MRSI to present and attend 4th LiDAR Tech 2022
MRSI will attend the 4th LiDAR Tech Forum taking place from November 16-18, 2022 in Suzhou, China. This event will focus on market trends, technological breakthroughs, and practical applications
MRSI to exhibit at the European Microwave Week in Milan
MRSI Systems welcomes you to the European Microwave Exhibition! This event is the largest trade show that is dedicated to Microwave and RF in Europe. It will be held from September 27th-29th in
MRSI presented “Assembly Challenges and Solutions for Photonics Devices in Automotive LIDAR” at Automotive LIDAR 2022
Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., presented “Assembly Challenges and Solutions
Visit MRSI at ECOC in Basel, Switzerland
MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.
What is the Future of Optoelectronics Packaging?
Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.
High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS)
die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing
Hybrid Electronics Technology for Printed Lighting
die-bonding Hybrid Electronics Technology for Printed Lighting Several members of the MRSI Systems’ team attended the February iMAPS New England-SMTA Boston Technical presentation by Dr. Adam
IMS 2019 Boston
die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.