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In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

At the recent IMAPS Conference in Arizona, co-planarity in die bonding was a key topic due to its importance in 2.5 and 3D chip stacking.

We are pleased to announce we are exhibiting with our distributor PREM at NEPCON Thailand, scheduled from June 18-21, 2025, at BITEC in Bangkok.

Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the

During the summer, China Fiber Optics Online (CFOL), interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Mycronic to discuss MRSI’s latest product development and some of the

Complex Hybrid Circuits are used in a variety of high reliability applications including military, aerospace, medical, and photonics. MRSI offers dispense and die bonding solutions specifically

MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.

MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our

There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high

The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.

SPIE Photonics West will be held at the Moscone Center in San Francisco, CA from Jan 27-Feb 1. This is the flagship event for companies in the photonics.

die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being

Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.

IMAPS New England Chapter’s Symposium will be held at the Boxborough Regency Hotel in Boxborough, MA, May 1st, 2018.

The 21st China International Optoelectronic Expo (CIOE) was held at the Shenzhen Convention and Exhibition Center from September 4-7th, 2019. As the world leader in optoelectronic device

The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 8-12, 2020.

MRSI Systems is exhibiting at the 52nd International Symposium on Microelectronics from September 30-October 2, 2019 in Boston, MA at the Hynes Convention Center. Schedule a meeting with MRSI

MRSI Mycronic is exhibiting at the Automotive LIDAR 2020 Conference and Virtual Exhibition from September 22-24th, 2020. See the conference agenda for more details. Visit the MRSI virtual booth

die-bonding IFOC 2020 MRSI Systems – CIOE 2020 & IFOC 2020 Highlights CIOE was held from September 9-11, 2020, in a new location at the Shenzhen World Exhibition & Convention Center.

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.

MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.

Meet with MRSI Systems in San Francisco

The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over

Innovation in wireless technology leads to faster and smarter networks. 5G and the Internet of Things (IoT) have the capacity to connect everyone & devices.

die-bonding High-Volume Manufacturing (HVM) of Photonics Devices – Success Requires Expertise in Eutectic Bonding of Chip on Submount (CoS) In this post we examine the critical manufacturing

die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The

die-bonding IMS 2019 Boston The International Microwave Symposium was held at the Pennsylvania Convention Center in Philadelphia last month. The event was well attended with over 8,400

The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.

Thank you to all who stopped by the MRSI booth at the International Microwave Symposium to discuss microwave RF package applications.