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High-power Laser Diode Manufacturing Challenges
This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:
Visit MRSI Systems at SEMICON China 2019 in Shanghai
MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.
MRSI solves one of the greatest challenges in modern photonics manufacturing
MRSI’s latest article in the July 2020 issue of Laser Focus World highlights a flexible die bonding solution for modern photonics manufacturing.
Thank You for Visiting MRSI at the International Microwave Symposium in Boston
The International Microwave Symposium was held at the Boston Convention Center last month. The event had over 9,000 attendees including exhibitors and guests, which represents a 14% increase over
MRSI-LEAP Ultra-High-Speed Die Bonders: Revolutionizing High-Volume Manufacturing
Ultra-high-speed die bonding technology is pivotal in modern manufacturing, particularly for optical modules production. The MRSI-LEAP Ultra-High-Speed Die Bonders exemplify this advancement,
MRSI Systems announces “One Stop Shop” die bonding solutions at CIOE and ECOC
STOCKHOLM, Aug. 30, 2018 — MRSI Systems (Mycronic Group) will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen
Dr. Limin Zhou to present at the 23rd Infostone Optical Communication and Market Technology Conference (IFOC 2025)
The annual Infostone Optical Communication and Market Technology Conference (IFOC 2025) is scheduled for September 8-9, 2025, at the InterContinental Hotel within the Shenzhen World Exhibition
MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market
MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced
Driving the Future: Dr. Limin Zhou to Present on AI-Driven Optical Module Packaging at the Innovation Conference on CPO (Co-Packaged Optics) and Heterogeneous Integration Technology
The Innovation Conference on CPO and Heterogeneous Integration Technology will take place September 4-6, 2025, in Wuxi, China. During the conference, Dr. Limin Zhou will discuss recent and
Join Us at IMAPS CHIPcon 2025: Shaping the Future of Chip Technology
We are excited to participate in IMAPS CHIPcon, the premier event for Chiplet and Heterogeneous Integration Packaging (CHIP) technology, from July 7–10, 2025, in San Jose, CA. This conference
MRSI Systems Launches New Software Video Training Programs
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispense systems.
Trends, Challenges and Opportunities for High Volume Manufacturing of Photonic Devices for Data Center Applications
There are many challenges that photonic device suppliers are facing in the current market. As part of IEEE’s Tech Insider Webinar Series, MRSI Systems recently delivered a presentation on high
Optical Fiber Conference and Exposition (OFC) 2018 – San Diego
The exhibition is from March 13th-March 15th. Visit the MRSI Systems’ Booth #4444 at OFC 2018. Enjoy a free “Exhibits Plus Pass” Compliments of MRSI Systems.
Visit MRSI Systems at Productronica 2017 in Munich, Germany
die-bonding Visit MRSI Systems at Productronica 2017 in Munich, Germany Productronica is the world’s leading international trade fair for innovative electronics production. The
MRSI Systems is Exhibiting at SPIE Photonics West
SPIE Photonics West will be held at the Moscone Center in San Francisco, CA from Jan 27-Feb 1. This is the flagship event for companies in the photonics.
MRSI Systems’ Exceptional Customer Support
die-bonding MRSI Systems’ Exceptional Customer Support After the sale, the real test of a quality business is what happens next. What happens if I have a problem? Can you reach a human being
MRSI Systems’ Customer Support – Peter Cronin
Customers appreciate the extensive product knowledge that the team has and that they are able to talk to a person that knows them and their machine.
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2017
The 50th Annual International Symposium on Microelectronics will be held October 9-12, 2017, in Raleigh, North Carolina. MRSI Systems will be exhibiting.
Axxon China
Axxon China Mycronic, Shenzhen Axxon Shenzhen Axxon Automation Co., Ltd A14 Building, Silicon Valley Power Automotive Innovation Park Guanlan Guiyue Road No.334 , 518110 Long Hua district,
Photonics Interconnects
Our software and technology Always one photon ahead – with industry ready 3D nano-printing and a full solution portfolio for Photonic Integration Based on its globally unique IP portfolio for
Mycronic erhåller order på tre maskritare
Mycronic AB (publ) har erhållit en order på tre maskritare från en befintlig kund i Asien: en Prexision 8 Evo, en Prexision Lite 8 Evo samt en SLX. Ordervärdet ligger i intervallet
Mycronic erhåller order på en SLX-maskritare
Mycronic AB (publ) har erhållit en order på en SLX-maskritare från en befintlig kund i Asien. Ordervärdet ligger i intervallet 4-6 MUSD. Systemet är planerat att levereras
Strategi
Strategi mot en hållbar framtid. Strategy Strategi Sustainable profitable growth We achieve sustainable and profitable growth both organically and through acquisitions. Organic growth is driven
Expertis & innovation
Expertis och innovation, förmåga att skapa nya produkter. Expertise and innovation Expertis och innovation Mycronic Group has a long history of innovation in many areas such as pattern
Historia
Mycronics historia MYdata MY 12 Historia Mycronics rötter går tillbaka till början av 1970-talet – när konsumentelektronik masstillverkades och mikroprocessorer började bli
Hållbarhet
Hållbarhet Så arbetar vi med hållbarhet och våra mål Hållbara lösningar för framtiden Fokus hållbarhet Fokus mångfald Fokus klimatpåverkan Ansvarsfull
Så arbetar vi med hållbarhet och våra mål
Vårt engagemang är att göra den elektroniska industrin mer hållbar. Our commitment to a sustainable electronics industry Our sustainability commitment and goals Mycronic strives
Våra policies
Våra policies Code of Conduct Distributor Code of Conduct Supplier Code of Conduct Supplier Code of Conduct for Service providers and non-critical Suppliers Quality and environmental policy
Vi tar ansvar för klimatpåverkan
Mycronic strives to achieve the goals of the Paris Climate Agreement. Key area: Climate impact We have set science-based targets to reduce our greenhouse gas emissions in alignment with the Paris
Organisation
Mycronics organisation, anställda från olika divisioner på huvudkontoret Täby. Vår verksamhet bedrivs i fyra divisioner Organisation Med huvudkontor i Sverige är vi en