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If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

At the IMAPS New England Symposium, MRSI will showcase our latest innovations.

Join MRSI at the upcoming Compound Semiconductor Advanced Technology and Application Conference (CSC) taking place on May 22-23, 2024, in Suzhou, China.

In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration has been built to proper specification.

A look behind the mask in a world driven by displays Breaking the displays barrier In 1974, the world’s first prototype for a flat, active-matrix LCD was demonstrated. Yet, without a technology

Leading optoelectronic and semiconductor packaging companies require fully automated, ultra-precision die bonding systems

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

As consumers expect more power and more bandwidth from their devices, we see the Advanced Electronic Packaging industry under continuing pressure to cram more technology into smaller spaces. One

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

MRSI Systems has been a leading supplier to manufacturers of advanced optical packaging assembly for over 30 years. This has enabled MRSI to build unmatched expertise in the assembly technologies

Eutectic bonding is used as an alternative to epoxy bonding. The choice of eutectic bonding is determined by the application and the technical requirements.

In the bustling world of technology, May was a month marked by significant events, and MRSI was at the forefront. With appearances at IMAPS New England in Boxborough, MA, and the 2024

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

The Global deployment of 5G and the exponential growth of data centers is driving the demand for high-performance optical devices.

Learn more about epoxy bleed from industry expert Tom Green. Here is the abstract of the white paper Silver Epoxy Turns Black After an Oxygen Plasma Clean Prior to Wire Bonding

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

This increased demand for photonics components is driven by the growth in optical networks. Learn more by reading more from MRSI Systems!

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Learn more about AOC from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.

Learn more about MRSI's training services including on-site training and software training videos. Contact Us.