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MRSI Mycronic will exhibit at the International Microelectronics Assembly & Packaging Society (IMAPS) New England Chapter’s 52nd Symposium & Exhibition, held in conjunction with the IMAPS

Mycronic AB (publ) has received an order for a customized SLX mask writer from a new customer. The order value is in the range of USD 27-30 million. Delivery of the system is planned for 2028.

Analysts, investors and media are invited to the presentation of Mycronic’s Q1 2026. The presentation will be held on April 24, 2026, at 10:00 a.m. CEST. The report is published on April 24, 2026,

If you’ve been following technology trends, you know that artificial intelligence (AI) has been at the center of innovation for the past several years. But is the AI boom just a fleeting trend,

Discover Mycronic’s Annual & Sustainability Report 2025, covering strategy, performance, innovation, and sustainability in advanced electronics manufacturing.

Mycronic AB (publ) today publishes its Annual Report 2025, which can be downloaded as a PDF from the report archive on the company’s website.

die-bonding Mycronic Global Technologies, Die Bonding, MRSI Equipment MRSI-705HF How global expertise fuels Mycronic’s innovation engine: Meet Gaurav Mishra Across Mycronic, our global teams are

Mycronic AB (publ) has received an order for an SLX mask writer from an existing customer in Asia. The order value is in the range of USD 5-7 million. Delivery of the system is planned for the

The shareholders in Mycronic AB (publ), corp. reg. no. 556351-2374, are hereby given notice of the Annual General Meeting to be held on May 6, 2026, 17:00. at the company’s premises at Nytorpsvägen

die-bonding OFC 2026 MRSI to exhibit Join us at the Optical Fiber Communications Conference and Exhibition (OFC) in Los Angeles! The exhibition features more than 700 industry-leading companies

March is gearing up to be an exciting month as our team is travelling to attend several major events and exhibitions. We’re excited to present our newest innovations and connect with the community

Mycronic is a leading Sweden-based electronics assembly solutions provider and invites visitors to explore their next innovations and discover the factory of the future at APEX 2026, Anaheim,

Customer centric leadership helps strengthen Mycronic’s global brand For more than 25 years, Peter Cronin has not only contributed to the success of our Die Bonding business line within our

Mycronic AB (publ) has appointed Annika Haaker as Senior Vice President People & Culture and member of Mycronic’s Executive Management team, with commencement at the latest on August 17,

The rapid advancement of artificial intelligence has brought renewed attention to the optical communication industry. This sector, now favored by both capital market and commercial customers, is

Find how Mycronic is bringing tomorrow´s electronics to life. We supply high precision production solutions to the electronics industry.

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。

die-bonding MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示 摘要：第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展，MRSI将在展位#4B79进行现场演示。MRSI

ICC讯 在IMAPS 2020上，MRSI Systems推出了新型5微米贴片机产品，面向量产配置的MRSI-705。MRSI-705于2012年首次推出，在贴片机行业中处于领先地位，可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能，可以在不牺牲灵活性，准确性和可靠性的前提下，显著提高机器的速度和生产率。

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)