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International Microwave Symposium 2018

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

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Highlights of the Microelectronics Symposium

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

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SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

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MRSI Systems—New Process Pages

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

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Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

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专访MRSI SYSTEMS周利民:MRSI-HVM-p系列贴片机助力光通讯产业高速发展

摘要:9月16-18日,CIOE 2021期间,MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台,讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品,MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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MRSI Systems to Exhibit MRSI-H-LD at Productronica

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019

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MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show

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MRSI Systems World Class Customer Support – Jack Inocencio

Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated

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Automotive LIDAR Conference and Exhibition 2019

MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on

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Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end

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Join MRSI Systems at SEMICON West 2019

MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.

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IMAPS Boston 2019 – Highlights

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS

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Magnetic Test

Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic

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Die Bonder

Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.

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Sitemap, die bonding

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The Speed of Light and the Future of Photonic Wire Bonding

The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and

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"The success of SLX is about people and technology along with the trust of our customers."

"The success of SLX is about people and technology along with the trust of our customers." What is the success behind the SLX series, and.. what is a mask writer? Charlott Samuelsson, Senior

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Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea?

Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea? Mycronic die bonders are utilized in the production of medical sensors for treating

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Did you know that Mycronic can assemble electronic components as tiny as a grain of sand?

Did you know that Mycronic can assemble electronic components as tiny as a grain of sand? Our MYPro A40 pick-and-place is at the heart of this incredible precision. These advanced machines are

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Innovating with solid-state lasers: Mycronic's commitment to climate change

Kristina Svanteson and Sara Mårtenson in a meeting about sustainbility Innovating with solid-state lasers: Mycronic's commitment to climate change Mycronic is committed to do its part to

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High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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Case Study – Leading Photonic Component Manufacturer Selects MRSI Systems to Produce Photonic Components Faster

The demand for data and bandwidth continues to expand, resulting in the requirement for high volume manufacturing of photonics devices at unprecedented levels.

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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Automated Die Bonding for High Volume Optoelectronics Packaging

As the Optoelectronics market is strong and growing, the technical requirements increase the challenges for manufacturers.

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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MRSI Systems Supports “Advancing Innovation in Photonics”

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics