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1.5 Micron Die Bonders
Learn more about MRSI's 1.5 micron die bonders.
High Precision Flip-chip Die Bonders
Learn more about MRSI's high precision flip chip die bonders.
About us
Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for
History
Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.
Why do customer's choose MRSI?
Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.
Thank you for contacting us regarding die bonding
Thank you for contacting us regarding die bonding
Die bonding solutions
Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.
Mycronic Sweden HQ
Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me
Test Solution (Suzhou) Co. Ltd.
Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86
Partners
See MRSI Systems strategic partner companies from all over the world that help MRSI Systems provide unsurpassed products for our customers.
5 Micron Die Bonders
Learn more about MRSI's 5 micron die bonders.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。
MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top
MRSI Systems to Exhibit MRSI-H-LD at Productronica
MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019
MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE
MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show
Automotive LIDAR Conference and Exhibition 2019
MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on
Meet with MRSI Systems at Photonics West in San Francisco
die-bonding Meet with MRSI Systems at Photonics West in San Francisco EXHIBITION PASS Meet with MRSI Systems in San Francisco Booth #4585 Learn about our latest technology at this FREE event.
IMAPS Boston 2019 – Highlights
die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing
Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.
MRSI Systems 推出用于大批量生产光电子器件的高速贴片机
美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。
MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education
North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the
MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing
BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed
MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品
MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。
MRSI Systems推出用于新应用的MRSI-HVM3P新产品
die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer