Gå till innehåll

Sök

Page

MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions

Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver

Page

Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

Page

Challenges in Die Bonding of Gallium Nitride High Power Devices

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

Page

Highlights of the Microelectronics Symposium

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

Page

MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

Page

MRSI Systems—New Process Pages

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

Page

Automotive LIDAR Conference 2018: AI & Autonomous Vehicles

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

Page

MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

Page

Die Bonding Solutions

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

Page

Mycronic technology essential in 5G development

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

Page

Die Bonding Process Pages – Highlights

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

Page

How Does MRSI Systems Manufacture to Customer’s Specification?

MRSI Systems thinks from the customer’s perspective and upholds strict protocols to ensure your desired configuration, has been built to proper specification. MRSI’s core value of acting like an

Page

MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!

Page

Software Video Training Programs for Die Bonding and Epoxy Dispense Systems

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

Page

Join MRSI at the 50th European Conference on Optical Communication

We are pleased to be exhibiting again this year at the 50th ECOC in Frankfurt am Main, Germany.

Page

Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

Page

Experience MRSI’s latest innovations at the OFC Exhibition

MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

Page

Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation

die-bonding Register for the Laser Focus World Webinar: Gen AI: Catalyst for Optical Module Innovation Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Mycronic and General Manager

Page

MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示

die-bonding MRSI中国新产品演示中心开业,将出席讯石研讨会,参加CIOE展会并提供现场演示 摘要:第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展,MRSI将在展位#4B79进行现场演示。MRSI

Page

MRSI introduces innovative MRSI-A-L Active Aligner for optical packaging solutions

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

Page

MRSI推出升级版MRSI-705贴片机 助力大批量制造

ICC讯 在IMAPS 2020上,MRSI Systems推出了新型5微米贴片机产品,面向量产配置的MRSI-705。MRSI-705于2012年首次推出,在贴片机行业中处于领先地位,可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能,可以在不牺牲灵活性,准确性和可靠性的前提下,显著提高机器的速度和生产率。

Page

MRSI introduces 705HF High Force Die Bonder for power devices and advanced chip packaging

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

Page

MRSI launches MRSI-705 high-volume configuration

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

Page

MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

Page

MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th

Page

MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

Page

MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

Page

Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

Page

MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

Page

Invitation to MRSI Webinar: MRSI is presenting at the 2022 ATC Webinar on Vehicle LIDAR Manufacturing

Abstract: on March 17th, 2022, Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., is invited to