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TO-TOSA/ROSA
Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
Software training videos
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.
On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so
MRSI Files Patent Infringement Lawsuit Against Palomar Technologies
Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement
MRSI将出席第18届ICCSZ OC市场与技术研讨会,并在CIOE提供贴片演示
MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会,研讨会将于9月2日至3日在中国深圳举行。同期,中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。
Newsletters archive
Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.
Magnetic Test
Enabling the next generation of spintronic devices Magnetic Automated Test Equipment for Memory and Sensors Hprobe, part of Mycronic’s Global Technologies division, delivers advanced Magnetic
MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)
TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including
Die Bonder
Choosing a die bonder is important, and we advise considering all options before making a purchase. With MRSI Systems, you can find exactly what you need.
Contact us
Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!
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MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.
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MRSI receives Laser Focus World Innovators Award for H-TO die bonder
MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the
MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品
MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。
MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging
At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.
MRSI Systems欢迎资深光电子专家周利民博士出任战略营销高级总监
2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司,MRSI Systems今日荣幸宣布,光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监,负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识,以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局,制定清晰的产品路线图,以及增强MRSI
MRSI Systems推出用于新应用的MRSI-HVM3P新产品
die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。
MRSI Systems推出新型MRSI-H3LD高速贴片机
MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。
MRSI宣布在中国深圳建立HVM3芯片贴装演示能力
MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。
MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family
BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer
MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain
STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and
MRSI Systems Acquires Die Bonding Business
BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the
Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era
The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。
MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019
MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.
MRSI Systems World Class Customer Support – Jack Inocencio
Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated