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MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

bare-board-testning atg Luther & Maelzer exhibit at CPCA 2024 This year's CPCA trade fair took place from 13 to 15 May 2024 at the National Exhibition Center in Shanghai. More than 700

Having a proven ultra-accurate die bonding system platform that is mechanically and thermally stable, with no cantilevered parts, are essential elements to achieve accurate device placement.

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

Flying probe for substrate test S3 S3-8 S3-8 The S3 is able to test 10 µm structures while achieving 100 measurements per second. The shuttle of the S3-8 can clamp and tension double sided

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system. atg Mycronic Solutions

bare-board-testning Excellent Partner Award from SCC atg Luther & Maelzer's Chinese unit, Test Solutions (Suzhou) Co (TSL), was invited to the supplier meeting in Guangzhou by its customer

bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2024 atg Luther Maelzer (a Mycronic company) will showcase their latest technology, the A9 with Automation (A9aL), at the upcoming

bare-board-testning atg Luther & Maelzer exhibit at IPC Apex 2023 This years IPC Apex show was held for the last time in sunny San Diego. The overall attendance over three days was approximately

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Mycronic in Wertheim, we offer apprenticeship programs for future industrial clerks and

Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for

News Press releases Our most recent news articles. Keep up to date with our most recent press releases. Our most recent news articles and press releases. PCB assembly news and press releases

Mycronic Sweden HQ Mycronic headquarter in the winter Mycronic AB Nytorpsvägen 9 Box 3141 183 03 Täby Sweden +46 8 638 52 00 +46 8 638 52 90 Mycronic Täby Yes, please contact me

Test Solution (Suzhou) Co. Ltd. Mycronic atg Luther & Maelzer China, Suzhou Industrial Park Test Solution (Suzhou) Co. Ltd. Block 5 # 301, No.5 Xinghan Street Suzhou Industrial Park China +86

pcb-assembly Our most recent news articles.

Protecting electronics assemblies are growing in complexity. Capability, versatility and precision are key.

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会，研讨会将于9月2日至3日在中国深圳举行。同期，中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司，MRSI Systems今日荣幸宣布，光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监，负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识，以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局，制定清晰的产品路线图，以及增强MRSI

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

MRSI Systems（Mycronic Group）很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度，测试结果显示，产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始，产品名称改为MRSI-H和MRSI-HVM（之前称为MRSI-H3和MRSI-HVM3）。