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MRSI HVM系列贴片机荣获Laser Focus World创新者奖

ICCSZ讯 近期,全自动,高精度,高速贴贴片与点胶系统的领先制造商MRSI Systems(Mycronic Group)被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。

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MRSI launches MRSI-705 high-volume configuration

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

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MRSI to offer die bonding demonstrations at Productronica

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

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MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th

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MRSI to Offer Live Die Bonding Demos at Laser World of Photonics, March 17-19, 2021

MRSI Systems (Mycronic Group) will offer live product demonstrations at Laser World of Photonics held at the Shanghai New International Expo Center (Booth #W2.2587) in Shanghai, China March

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MRSI Systems and Palomar Technologies Reach Agreement in Intellectual Property Dispute

Boston, MA – December 10, 2020 – MRSI Systems, LLC and Palomar Technologies, Inc. jointly announce they have reached a confidential agreement that settles all litigation currently pending between

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MRSI-175Ag – A flexible epoxy dispensing solution

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

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Jon Medernach to retire after a triumphant twenty years at MRSI Systems

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

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Die Bonding Process Pages – Highlights

Various die bonding approaches have been, and still are, developed to meet the ever-evolving product requirements.

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MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!

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Software Video Training Programs for Die Bonding and Epoxy Dispense Systems

These videos help you to discover advanced features of our MRSI machines, which will ensure your production line is optimized.

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Die bonding solution for Chip-on-Submount (CoS) – Excerpt from our LFW article

Excerpt from MRSI’s recent article emphasizes the CoS die bonding process requirements including geometric placement accuracy & void free eutectic bonding.

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Experience MRSI’s latest innovations at the OFC Exhibition

MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

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Watch MRSI’s Software Training Videos

die-bonding Watch MRSI’s Software Training Videos MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These

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MRSI to present and attend Auto Lidar Tech 2023

MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR

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Quantum Technologies

Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this

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Space & Defense

Space & Defense Photonic Integration Solutions for Space and Defense The evolution of Space and Defense technologies relies on advanced optical solutions for remote sensing, advanced

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AI & Machine Learning

AI & Machine Learning Enabling the AI/ML Revolution with Advanced Photonic Packaging The rapid advancements in Artificial Intelligence (AI) and Machine Learning (ML) are driving demand for

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PCB assembly

Discover Mycronic’s high‑precision SMT machines and complete PCB assembly solutions designed for flexible, efficient electronics manufacturing.

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Jet printing

Mycronic jet printing technology makes it possible to dispense solder paste for the most challenging circuit boards and components. Learn more!

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Stencil printing

High-Speed Stencil Printing for PCB Assembly Lines. Learn more!

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PCB assembly solutions

Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and accuracy in mind, and are built to ensure maximum

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The perfect solder joint

Each component gets the right amount of solder paste with jet printing technology instead of stencil printing.

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User-driven design

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

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Process software

The richest smt software suite in the industry. Provides fully integrated applications covering the entire chain Enhance your productivity of SMT assembly.

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Solutions

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

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Automated optical inspection

Mycronic AOI products provide Automated Optical Inspection ensures quality and reliability in your production processes.

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Component storage

Automated, highly flexible and expandable component storage tower with a small footprint, designed for deployment near the production line.

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Mycronic Japan Yokohama

Mycronic Japan Mycronic Tokyo Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45 320

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Mycronic China

Mycronic China Shanghai, China Mycronic Co., Ltd (Shanghai Office) Unit 1002, 10th floor, E Block Lane 168, Da Duhe Road Putuo District, 200062 Shanghai P.R. China +86 21 3252 3785/86 +86 21 3252