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In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

The world’s largest Microwave and RF industry event is being held virtually this year. 

MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.

ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those

ICCSZ讯 近日，全自动，高速，高精度，灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下，讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。

摘要：9月16-18日，CIOE 2021期间，MRSI SYSTEMS携携最新的MRSI-HVM带轨道双机头固晶机精彩亮相。在4B79展台，讯石以现场视频直播方式走进MRSI SYSTEMS展台参观了正在进行演示的产品，MRSI SYSTEMS战略营销高级总监周利民博士向观众介绍本次参展的新产品。

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top

MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.

Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated

Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end

Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with

MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.

die-bonding International Microwave Symposium 2019 MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the

9月4日－7日，全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会（简称光博会／CIOE）在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业，MRSI Systems（Mycronic Group）与CYCAD Century Science and Technology携手亮相本次光博会，并重点展出MRSI－H、MRSI－HVM等系列产品与最新技术。

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.