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MRSI Systems最新1.5μm系列产品荣获“中国光电博览奖”银奖

摘要:由中国国际光电博览会(CIOE)提议设立的”中国光电博览奖“,MRSI Systems携最新的MRSI-HVM 1.5微米系列产品参评,成功入围“中国光电博览奖”。MRSI-HVM-P项目属于高端光电子封装自动化技术领域,广泛用应于当下高密度高速率的数据中心光互联和骨干网络传输用的400G +光电器件,以及5G无线应用的复杂DFB / WDM / EML TO-can TOSA /

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MRSI-H-TO 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

On January 11, 2022, the Infostone 2022 Annual meeting and the 8th Heroes List awards ceremony were held. Infostone announced the 8th heroes company list, which is classified into four

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High-power Laser Diode Manufacturing Challenges

This excerpt from MRSI Systems featured article in Laser Focus World highlights the HPLD industry manufacturing challenges and a die bonding solution to address these challenges:

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Join us at IMAPS in Boston!

MRSI Mycronic is exhibiting at the 57th International Symposium on Microelectronics from October 1-2, 2024, in Boston, MA. The event will take place at the Encore Boston Harbor from October 1-3,

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Visit MRSI at ECOC in Basel, Switzerland

MRSI will be exhibiting at the 48th exhibition of ECOC in Basel, Switzerland from September 19-21st.

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An internship that takes the leap into technology

Tekniksprånget 2020 Tekniksprånget 2020 An internship that takes the leap into technology The Swedish initiative Tekniksprånget (Technology Leap) is a four-month paid internship program

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5G technology fuels connectivity and innovation

5G technology, with 100 times faster speeds than 4G, opens up new possibilities for consumers and businesses. And it’s already placing tough demands on manufacturers as well!

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AI is the secret weapon for higher productivity

AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.

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Mycronic joins United Nations Global Compact

Mycronic joins United Nations Global Compact Mycronic joins United Nations Global Compact Sustainability is a key element of Mycronic’s business strategy and we are continuously working to

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The trend towards a climate neutral electronics sector

Discover how Mycronic’s innovative products, such as the SLX mask writer, can help the electronics sector achieve climate neutrality by saving energy and reducing waste.

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Imprint

Mycronic AB Box 3141,  18303 Täby, Sweden Phone: +46 8 638 52 00 E-Mail: info@mycronic.com   CEO: Anders Lindqvist Company Registration Number: 556351-2374 VAT Number:

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A showcase stockroom

How intelligent material handling can win customers and grow your business

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Manual flying probe for PCB test

Manual flying probe for PCB test A5 Neo A7 Pro A7-16 Pro A7XW Pro A9 A9 plus A9L A9XL A5 Neo A7 Pro The A5 Neo Flying Probe PCB tester combines affordable technology with all of the enhanced

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Why work at Mycronic?

5 reasons to join Mycronic Why work at Mycronic? In our open and collaborative workplace, you’ll give and get inspiration in equal measure. 1. Bring tomorrow’s electronics to life For over 40

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Large area measurement

Meet the world's most accurate metrology system Large area measurement Challenge The crucial component in today’s high-quality displays is their set of photomasks, which must match each other

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Contact us

Contact us Visit our contact page for contact details for our sales and support departments.

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News

photomask-equipment Read our latest news here.

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新机发布|MRSI(Mycronic集团)发布创新MRSI-A-L耦合设备,引领精密光学组件封装新纪元

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

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Microelectronics

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

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High Power Laser Diodes

Learn more about High Power Laser Diodes from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

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MRSI Mycronic Opens New Demo Center in Shenzhen, China

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

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Processes

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

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Events

die-bonding

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MRSI Systems’ New Product MRSI-HVM3 Die Bonder Has Entered Volume Production Driven by Fast and Wide Customer Adoptions

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

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MRSI Systems Receives Funding from State of Massachusetts for Advanced Manufacturing Initiative

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

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MRSI Systems 热烈欢迎贺尉宗出任中国区销售总监

MRSI Systems(Mycronic Group)很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作,并作为中国区销售代表服务市场,工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

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MRSI Systems welcomes Hendry He as China Country Sales Director

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

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MRSI receives Laser Focus World Innovators Award for HVM die bonder

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

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MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

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MRSI Launches New MRSI-H3LD Die Bonder Targeted at the High Power Diode Laser Market

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced