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1 Micron Die Bonders
Learn more about MRSI's 1 micron die bonders.
1.5 Micron Die Bonders
Learn more about MRSI's 1.5 micron die bonders.
AOC
Learn more about AOC from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
TO-TOSA/ROSA
Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.
High Precision Flip-chip Die Bonders
Learn more about MRSI's high precision flip chip die bonders.
Software training videos
MRSI is now offering an extensive library of software training videos for your MRSI die bonding and epoxy dispensing systems. Contact MRSI to learn more.
On-site training
MRSI offers a comprehensive set of training programs covering our family of products. Contact MRSI Systems to learn more about On-Site Training.
Prototyping and Training Services
We provide prototyping and small batch die bonding services for our customers to shorten your time to market.
Image gallery
Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.
Join us in March!
March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more
Advanced Packaging for Heterogeneous Integration
Advanced heterogeneous integration for 3-D IC packaging, e.g., chiplet, and optoelectronics packaging requires high-precision die bonders that can perform many different processes, such as
Exploring Automotive LiDAR Packaging Trends
In the November/December 2023 issue of Chip Scale Review, MRSI delves into the fascinating world of automotive light detection and ranging (LiDAR) technology. This article explores the parallels
Precision and Reliability in Defense Electronics: Exploring MRSI’s Industry-Leading Solutions
Designing and manufacturing electronic components destined for defense applications entails navigating a landscape of exacting standards. These standards demand unparalleled reliability, minimal
Advancing automation: unleashing the power of the automatic tool changing turret
In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented
MRSI New Solution: Tape Holder
If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips
The MRSI-H1 Family: Unleashing Precision and Agility
The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.
MRSI to present at Automotive LIDAR 2021
MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,
MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos
MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September
MRSI-705 innovative high-volume configuration for lower cost manufacturing
5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.
MRSI Systems受邀出席光收发器和硅基光电子论坛
摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。
IMAPS 2020 Virtual Exhibition
MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting
MRSI’s August 2020 Laser Focus World Featured Article: Assembly solution addresses TO-can photonic device manufacturing challenges
In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.
Irving Wang joins MRSI – Product Marketing
Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM
Join MRSI at the International Microwave Symposium
The world’s largest Microwave and RF industry event is being held virtually this year.
SEMICON West 2020 Virtual Event
MRSI Systems invites you to SEMICON West 2020 Virtual Event from July 20-23, 2020.
Presentation Q3 report 2022
Presentation Q3 report 2022 Presentation of Mycronic's Q3 report January-September 2022 Interim report January-September 2022 Presentation Q3 report
Health & safety policy
ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those
MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent
Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so
Jon Medernach to retire after a triumphant twenty years at MRSI Systems
After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North
MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”
MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!