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5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

摘要：MRSI Systems战略市场高级总监，周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

Quantum Technologies The Future of Quantum: Powered by Photonic Integration Quantum technologies are poised to revolutionize fields like computing, communication, and sensing. However, this

Space & Defense Photonic Integration Solutions for Space and Defense The evolution of Space and Defense technologies relies on advanced optical solutions for remote sensing, advanced

AI & Machine Learning Enabling the AI/ML Revolution with Advanced Photonic Packaging The rapid advancements in Artificial Intelligence (AI) and Machine Learning (ML) are driving demand for

MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,

Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade

ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those

Just outside of Nürnberg, Germany, one forward-thinking manufacturer is rapidly modernizing its production to meet fast-growing demands for advanced industrial IoT electronics. Thanks to the

Mr. Liu Haifeng has never been one to stick with the status quo. As General Manager of Wuxi Good Electronics Co., Ltd., he is always on the hunt for the latest production technologies, new

21st century industries demand 21st century manufacturing solutions. With the help of the latest 3D automated optical inspection systems, MSL Circuits – an ALL Circuits company, is helping

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

die-bonding

die-bonding MRSI Mycronic CIOE Booth 2025 MRSI Mycronic to showcase high-speed assembly solutions at CIOE 2025 MRSI Mycronic, part of the Mycronic Group, will present advanced assembly solutions

die-bonding MRSI中国新产品演示中心开业，将出席讯石研讨会，参加CIOE展会并提供现场演示 摘要：第23届中国国际光电博览会(CIOE)将于2021年9月16-18日在深圳国际会展中心举办。MRSI Systems (Mycronic Group)届时将携最新的MRSI-HVM带轨道双机头固晶机参展，MRSI将在展位#4B79进行现场演示。MRSI

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, has launched the MRSI-705HF high

die-bonding CIOE 2023 MRSI Booth MRSI Mycronic to showcase and present innovative die bonder solutions at CIOE 2023 MRSI, a part of Mycronic Group, will exhibit our family of die bonders and

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

Flying probe for substrate test S3 S3-8 S3-8 The S3 is able to test 10 µm structures while achieving 100 measurements per second. The shuttle of the S3-8 can clamp and tension double sided

Solutions Flying ahead in Michigan with Calumet A9a Mycronic is providing its latest Flying Probe electrical testing system. atg Mycronic Solutions

Accelerating R&D cycles and expanding product mix in China

Career Available jobs About us Apprenticeship program See your future opportunities here See your future opportunities here. What we offer. Education for future industrial clerks, technical

Apprenticeship program Are you interested in an apprenticeship in an international company? At atg Mycronic in Wertheim, we offer apprenticeship programs for future industrial clerks and