Gå till innehåll

Sök

Page

News & events

News & events Events News Press releases Cases Technical articles archive Webinars Gallery Video gallery MRSI events Our future events & webinars. Our most recent news articles. Keep up to

Page

TO-TOSA/ROSA

Learn more about TO-TOSA/ROSA from MRSI Systems who has been a leading supplier to manufacturers of advanced optical assembly for over 40 years.

Page

Image gallery

Check out the MRSI Systems gallery for images and videos of MRSI die bonding and epoxy dispensing systems available from MRSI Systems in MA.

Page

MRSI Systems Wins Years-Long Litigation Against Palomar Technologies By Invalidating Palomar’s “Double Pick” Patent

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

Page

MRSI Files Patent Infringement Lawsuit Against Palomar Technologies

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

Page

MRSI Systems 推出用于大批量生产光电子器件的高速贴片机

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商,MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机,以支持光电子客户的大批量生产需求。目前,MRSI-HVM3 正在全面投产并发货至世界各地的客户。

Page

MRSI Systems Delivered 3-Micron Die Bonder MRSI-M3 to AIM Photonics Academy’s Education and Practice Factory at MIT in Cambridge for Research and Education

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

Page

MRSI Systems Launches High Speed Die Bonder for Photonics High Volume Manufacturing

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

Page

MRSI launches submicron die bonding solution for silicon photonics, co-packaging, and wafer-level packaging

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

Page

MRSI receives Laser Focus World Silver Award for MRSI-H-HPLD Die Bonder

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

Page

MRSI Systems Launches MRSI-HVM3P for New Applications Extending the MRSI-HVM3 Die Bonder Family

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

Page

MRSI Systems Announces Chinese Patent Issued Covering Die Placement Head with Turret

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

Page

MRSI Systems Acquires Die Bonding Business

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

Page

Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

Page

MRSI to present at Automotive LIDAR 2021

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021. MRSI is presenting on Wednesday,

Page

MRSI presented at the 12th China International Nanotechnology Industry Expo

The 12th China International Nanotechnology Industry Expo was held in Suzhou, Jiangsu Province from October 27th to 29th, 2021. Dr. Limin Zhou, Senior Director of Strategic Marketing, MRSI

Page

MRSI to present at IFOC and Exhibit at CIOE in September in Shenzhen including live product demos

MRSI Systems will present at the 19th Infostone Optical Communications Conference(IFOC), organized by Infostone Communication Consultant. The event will take place in Shenzhen, China from September

Page

MRSI-705 innovative high-volume configuration for lower cost manufacturing

5G infrastructure will require ultra-high bandwidth, latency up to 1 ms, and highly reliable connectivity. In addition, RF architectures need to be scalable, efficient, and extremely compact.

Page

MRSI Systems受邀出席光收发器和硅基光电子论坛

摘要:MRSI Systems战略市场高级总监,周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

Page

IMAPS 2020 Virtual Exhibition

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

Page

Irving Wang joins MRSI – Product Marketing

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

Page

Visit MRSI at SEMICON West in San Francisco

MRSI is exhibiting at SEMICON West from December 7-9, 2021 at the Moscone Center, San Francisco, CA (Booth #1556). SEMICON West features hundreds of exhibitors, and thousands of attendees,

Page

Bruno Afonso joins MRSI – Sales

Bruno Afonso has joined MRSI as the Sales Director, EMEA. He is located in Switzerland and earned his BA in Industrial Engineering and his Master Degree in Electrical Engineering from Universidade

Page

Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。

Page

Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

Page

Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging

Page

Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)

ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。

Page

MRSI Systems to Exhibit MRSI-H-LD at Productronica

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019

Page

MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show

Page

Automotive LIDAR Conference and Exhibition 2019

MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on