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Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

MRSI Systems(Mycronic Group)赞助由ICCSZ举办的第18届光纤通讯市场暨技术专题研讨会，研讨会将于9月2日至3日在中国深圳举行。同期，中国国际光电博览会(CIOE)于2019年9月4日至7日在中国深圳隆重召开。

2019年2月13日–全球领先的半导体系统设备制造商Mycronic集团的子公司，MRSI Systems今日荣幸宣布，光电子资深专家周利民博士将加入公司团队并担任战略营销高级总监，负责拓展MRSI Systems在中国的市场影响力。周博士在光电子行业拥有的丰富专业知识，以及他在中国市场的知名度将有助于推动MRSISystems市场战略布局，制定清晰的产品路线图，以及增强MRSI

MRSI Systems（Mycronic Group）很高兴宣布公司MRSI-H / HVM系列产品线的最新进展。MRSI使用行业标准玻璃芯片参考样品测试放置精度，测试结果显示，产品精度从3Sigma的±3微米增强至±1.5微米。该产品从2019年10月1日发货开始，产品名称改为MRSI-H和MRSI-HVM（之前称为MRSI-H3和MRSI-HVM3）。

MRSI Systems, part of the Mycronic Group is pleased to announce the appointment of Dr. Limin Zhou as the Senior Director of Strategic Marketing to expand MRSI’s market presence in China. He will

MRSI Systems and CYCAD Century Science and Technology will partner together at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86.

ICCSZ讯 近期，全自动，高精度，高速贴贴片与点胶系统的领先制造商MRSI Systems（Mycronic Group）被授予2019年Laser Focus World 创新者奖的光电子器件制造设备类银奖。

MRSI Systems (Mycronic Group) will be exhibiting with Mycronic at Productronica. Product demos will be offered at the Mycronic Booth #341 in Hall A3 (SMT Cluster). The exhibition will be held at

North Billerica, MA, USA, March 20, 2017 — MRSI Systems, a leading provider of fully automated, high-speed, high-precision die bonding and epoxy dispensing systems, today announces the

MRSI Systems is delighted to announce a new collaboration with Lumentum Operations LLC ("Lumentum", NASDAQ: LITE), a leading global photonic chip and module supplier for the automotive LiDAR

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

At CIOE 2020 MRSI Systems will introduce a new product, MRSI-S-HVM high-speed, flexible 0.5 micrometer die bonder for silicon photonics, co-packaging.

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2022 Silver Honoree for the

MRSI Systems宣布“DIE PLACEMENT HEAD WITH TURRET”(集成水平转塔之芯片贴装头)已获得中国专利授权。迈康尼全球技术部的业务部门-MRSI Systems宣布，中华人民共和国国家知识产权局(CNIPA)已于2021年7月30日授权MRSI Systems 申请的“DIE PLACEMENT HEAD WITH

Mycronic Global Technologies Business Unit, MRSI Systems announces the recent issuance of utility patent titled “DIE PLACEMENT HEAD WITH TURRET” and numbered ZL 201680048482.5 (PCT/US2016/047135)

MRSI Systems (Mycronic Group) is pleased to announce the introduction of MRSI-H-HPLD+, the latest advancement in the MRSI-H/HVM-series product line. This new variant of the successful

MRSI (Mycronic Group) is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2021 Virtual Conference and Exhibition from September 21-23rd, 2021, a leading event in the

BILLERICA, MA — January 31, 2014 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, announced today it has completed a leveraged buyout of assets from

美国马萨诸塞州, August 14, 2017 – 全球领先的全自动、高精度、高速贴片和点胶系统制造商，MRSI Systems推出一款新型产品, MRSI-HVM3 高速贴片机，以支持光电子客户的大批量生产需求。目前，MRSI-HVM3 正在全面投产并发货至世界各地的客户。

BILLERICA, Mass., August 14, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, is launching a new High Speed

MRSI系统公司（Mycronic集团）推出MRSI－H3TO新型3微米高速贴片机，这是业界第一款可以真正满足多晶片和多流程的要求，可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI－H3TO专为WDM与EML－TO或其他多晶片多流程TO－can光电器件量身打造，以支持即将普及的5G无线网络。

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems（Mycronic集团）8月20日在美国马萨诸塞州扩展其业界领先的MRSI－HVM3高速贴片机机平台，推出MRSI－HVM3P新款机型，为有源光缆（AOC）、管盒（Gold－box）封装 以及 基板芯片（CoC）之外 的其他应用提供优化配置。

MRSI系统公司（Mycronic集团）推出MRSI－H3LD新型3微米高速贴片机，专用于大功率半导体激光器中的芯片贴片，广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

MRSI Systems（Mycronic集团）宣布在其位于深圳龙华的姐妹公司，深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料，安排并提供我们市场领先的MRSI－HVM3产品的本地演示以及芯片贴装应用。

BILLERICA, Massachusetts, Aug. 29, 2018 — MRSI Systems (Mycronic Group), is expanding its leading high speed MRSI-HVM3 die bonder platform with the launch of the MRSI-HVM3P to offer

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North