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摘要：MRSI Systems战略市场高级总监，周利民博士受邀参加光收发器和硅基光电子论坛并将带来主题为“光收发器和硅基光电子量产的挑战及解决方案”的演讲。

MRSI is exhibiting at the 53rd International Symposium on Microelectronics from October 6-8th, 2020. Visit the MRSI Virtual Booth to chat with our team of technical experts to review our exciting

In this week’s blog post we highlight our recent Laser Focus World published article on the challenges of new TO-can photonic device manufacturing.

Irving Wang joined MRSI this year as the Director of Product Marketing. He is based in the US to spearhead MRSI’s push into the sub-micron market and to support our newly launched MRSI-S-HVM

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product

ID: 80400 | Version: 3 | Published: April 15, 2024 Mycronic group health and safety policy Mycronic is committed to providing a safe, healthy environment for employees, consultants and all those

Fully automatic high accuracy die bonders that are capable of epoxy and eutectic die bonding are the lifeblood of the modern semiconductor industry.

See what real MRSI Systems customers are saying about our Die Bonding and Epoxy Dispensing systems and how they have helped them succeed.

Learn more about MRSI's 1 micron die bonders.

Learn more about MRSI's high precision flip chip die bonders.

Under the MRSI brand, we leverage over 40 years of industry expertise in high-accuracy die bonders, active aligners, and fluid dispensers to deliver unparalleled reliability and precision for

Learn about MRSI Systems, a MA die bonding and epoxy dispensing system manufacturer in MA.

Learn about MRSI Systems capabilities and what helps MRSI stand apart from the competition in die bonder and epoxy dispensing system manufacturing.

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“Solutions for Mass Production of Vehicle LiDAR.” LiDAR has become a critical sensor for autonomous driving.

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

MRSI Systems (Mycronic Group) will exhibit at the 23rd China International Optoelectronic Exposition (CIOE) at the Shenzhen World Exhibition & Convention Center from September 16-18, 2021. MRSI

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。

ICC讯 在IMAPS 2020上，MRSI Systems推出了新型5微米贴片机产品，面向量产配置的MRSI-705。MRSI-705于2012年首次推出，在贴片机行业中处于领先地位，可在一台机器上为客户提供多种应用解决方案。MRSI-705新的配置提供了创新的水平转塔功能，可以在不牺牲灵活性，准确性和可靠性的前提下，显著提高机器的速度和生产率。

At IMAPS 2020 MRSI Systems will introduce a new 5 micrometer die bonder product, MRSI-705 high-volume configuration. The MRSI-705 was first introduced in 2012 and has enjoyed a dominant position

die-bonding MRSI to exhibit with live demonstrations and present at the China International Optoelectronic Expo We are proud to announce that MRSI, Mycronic Group will be exhibiting at the 24th