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North Billerica, MA, USA, May 24, 2016 — MRSI Systems, a leading provider of fully automated, ultra-precision die bonding and epoxy dispensing systems, today announces supply of its flagship

Customers require an application-specific specialized die bonder for HVM of CoS that is able to deliver high speeds while maintaining flexibility.

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

ID: 80388 | Version: 1 | Published: 2023-02-06 Whistleblower policy Mycronic AB provides a special reporting channel where employees within the Mycronic Group may report serious wrongdoing within

Innovation and new market factors are driving advanced packaging. In this post, we highlight some of the trending topics propelling advanced packaging.

In March 2017, MRSI Systems participated in The MIT Microphotonics Center and AIM Photonics Spring Meeting for Integrated Photonics Manufacturing Meeting.

Presentation year-end report 2023 Presentation of Mycronic's year-end report January-December 2023   Watch the presentation here  

Interim Report Q3 2023 Presentation of Mycronic's interim report January-September 2023 Interim report January-September 2023 Presentation Q3 report

Tekniksprånget 2020 Tekniksprånget 2020 An internship that takes the leap into technology The Swedish initiative Tekniksprånget (Technology Leap) is a four-month paid internship program

5G technology, with 100 times faster speeds than 4G, opens up new possibilities for consumers and businesses. And it’s already placing tough demands on manufacturers as well!

AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.

Mycronic joins United Nations Global Compact Mycronic joins United Nations Global Compact Sustainability is a key element of Mycronic’s business strategy and we are continuously working to

Discover how Mycronic’s innovative products, such as the SLX mask writer, can help the electronics sector achieve climate neutrality by saving energy and reducing waste.

Beyond tech: Mycronic’s vision for sustainable innovation You might think that sustainable innovation is all about technical advancements, but this concept can be much broader. We believe that

A record finish to a record year in Q4, 2023 - CEO commenting on report After a record finish to a record year in Q4, 2023, we are happy to share our Year-end Report January-December 2023.

Mycronic Fukuoka Mycronic Assembly Solutions Co. Ltd. 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

Discover how Carl Jacobsson, Group Production Manager at Mycronic in Täby, Sweden, revolutionizes production by implementing a ‘lean management’ approach. Learn about waste reduction,

Mycronic 4.0 is a complete, agile manufacturing solution that masters the complexity of modern electronics production – a highly automated, intelligent factory for just-in-time production, with

Deliver extremely precise paste volume measurement on even the smallest pads with PI series 3D SPI. Easy and smart auto-programming functions that ensure high-quality inspection within line takt

Mycronic service network spans the globe, with service engineers present in more than 50 countries who are specially trained and certified.

Highlights of the new mounthead technology include Engineering a new generation of high-speed assembly Flexibility. Turbocharged. The new MX7 mounthead Higher throughput The MX7 enables top

How intelligent material handling can win customers and grow your business

pcb-assembly - that can monitor your heart rate Feather-light band-aid sensor SINTEC, AN EU-FINANCED PROJECT FOCUSED ON DEVELOPING SOFT STRETCHABLE ELECTRONICS, CAN NOW PRESENT ITS LATEST