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Join MRSI at SEMICON West 2022

We are excited to announce that MRSI Systems will be exhibiting at SEMICON West from July 12-14th at the Moscone Center in San Francisco! Visit us at booth #2355 to talk with us about topics such

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Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

9月4日-7日,全球极具规模及影响力的光电产业综合性展会——第21届中国国际光电博览会(简称光博会/CIOE)在深圳会展中心举办。作为全球光电器件自动化贴片封装设备的领军企业,MRSI Systems(Mycronic Group)与CYCAD Century Science and Technology携手亮相本次光博会,并重点展出MRSI-H、MRSI-HVM等系列产品与最新技术。

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Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility

MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the

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Dr. Yi Qian, MRSI Systems: Automated Die Bonding Trends in the 5G Era

The arrival of 5G marks a new era for the manufacturing supply chain. This transformation presents new challenges for die bonding and packaging processes. As a leader in the automated packaging

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Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders

Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.

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Challenges in Die Bonding of Gallium Nitride High Power Devices

Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...

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Highlights of the Microelectronics Symposium

The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic

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MRSI Systems—New Process Pages

These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.

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Automotive LIDAR Conference 2018: AI & Autonomous Vehicles

MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI

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MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums

MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including

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Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2017 — New Die Bonder for High Volume Manufacturing

Over three decades, MRSI Systems has developed a family of high precision eutectic die bonders for high volume manufacturing of optoelectronics.

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High Volume Manufacturing of Photonic Devices: Assembly Starts with Design

The explosive growth of internet traffic demands higher bandwidth in data communications. High volume manufacturing of photonic devices is crucial.

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International Microwave Symposium 2018

MRSI Systems is exhibiting at IMS (Booth #448)—the world’s largest Microwave and RF industry event in Philadelphia, PA at the Pennsylvania Convention Center June 10-15, 2018.

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Fully Automated Die Bonding Systems — The Importance of Proper Lighting

Lighting is an important component of any vision recognition system. When it comes to lighting, it is not a case of “one size fits all.”

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SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions

All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an

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Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era

MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics

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China International Optoelectronic Expo – September 2017

die-bonding MRSI CYCAD CIOE Booth 2017 China International Optoelectronic Expo – September 2017 MRSI Systems is exhibiting at CIOE with our Chinese Representative CYCAD Century Science and

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MRSI Systems Supports “Advancing Innovation in Photonics”

die-bonding MRSI Systems Supports “Advancing Innovation in Photonics” Background MRSI Systems is a community member of AIM (American Institute of Manufacturing) Photonics and the local Photonics

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Join MRSI Systems at OFC!

MRSI is exhibiting at the Optical Fiber Communication Conference and Exhibition (OFC) March 21-23, at the Los Angeles Convention Center (Booth 1728). We invite you to explore MRSI’s product

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Technology Students Experience Local Advanced Technology Manufacturer Up Close

Middlesex Community College technology students recently visited our factory in Billerica, MA.

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Interview with MRSI Systems Dr. Limin Zhou: MRSI Die Bonders support the fast growth of the optical communication market

During 2021 CIOE in Shenzhen, China, Infostone, interviewed Dr. Limin Zhou, Senior Strategic Marketing Director of MRSI Systems (Mycronic Group) to discuss MRSI’s latest product developments and

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MRSI Systems (Mycronic Group) delivered a keynote speech at the 2022 CFOL Optical Interconnection Conference and MRSI-H-HPLD+ 1.5 micron Die Bonder won the Award for “2022 CFOL Product Innovation”

Dr. Limin Zhou, Senior Director of Strategic Marketing at MRSI Systems (Mycronic Group) and General Manager of MRSI Automation (Shenzhen) Co., Ltd., was invited to participate in the 2022 CFOL

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Mycronic technology essential in 5G development

die-bonding Mycronic technology essential in 5G development Die bonding systems are required for the groundbreaking digital transition Mycronic technology essential in 5G development 5G is

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MRSI Named in the 2019 Infostone Top Honors List in China, with the MRSI-HVM Series Receiving the Award for the Most Competitive Product for Optical Communications

MRSI Systems (Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed die bonding and dispensing systems, has been recognized in the list of 2019 Infostone top

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MRSI Systems to Exhibit MRSI-H-LD at Productronica

MRSI Systems is a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems, and will be exhibiting at Productronica from November 12-15, 2019

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MRSI is Presenting at ICCSZ OC Market and Technology Seminar and Offering Die Bonder Demonstrations at CIOE

MRSI Systems and CYCAD Century Science and Technology will partner at the 21st China International Optoelectronic Exposition (CIOE). Product demos will be offered at Cycad’s booth #1C86. The show

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Automotive LIDAR Conference and Exhibition 2019

MRSI Systems is exhibiting, sponsoring, and presenting at the Automotive LIDAR 2019 Conference and Exhibition in Detroit, Michigan from September 25-26th, 2019. MRSI Systems is presenting on

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Laser Focus World Featured Article – Die-bonder innovations target HPLD manufacturing challenges

MRSI’s latest article in Laser Focus World’s February Issue “Die-bonder innovations target HPLD manufacturing challenges” discusses the die bonding challenges of High-power laser diodes (HPLDs)

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Meet with MRSI Systems at Photonics West in San Francisco

die-bonding Meet with MRSI Systems at Photonics West in San Francisco EXHIBITION PASS Meet with MRSI Systems in San Francisco Booth #4585 Learn about our latest technology at this FREE event.

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IMAPS Boston 2019 – Highlights

die-bonding IMAPS Boston 2019 – Highlights MRSI Systems has been a member and proud supporter of IMAPS for more than 30 years and was pleased to sponsor the exhibition at the 2019 IMAPS