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MRSI Systems (a part of Mycronic Group), a leading manufacturer of fully automated, high-precision, high-speed, flexible die bonding and epoxy dispensing systems, proudly introduces the MRSI-A-L

MRSI Systems has been a leading supplier to assembly houses and OEMs involved with hybrid assembly die bonding systems for more than 40 years.

MRSI Systems (Mycronic Group) a leading manufacturer of fully automated, high-precision, high-speed die bonding, and epoxy dispensing systems has been recognized as a 2019 Silver Honoree for

MRSI Systems (Mycronic Group) has opened the doors to their new “Product Demo Center” in Shenzhen, China. The new demo center is in the Huahan Innovation Office Park in the Nanshan District of

Processes Die bonding Epoxy die bonding Eutectic die bonding MRSI Die Bonder MRSI Die Bonding MRSI Eutectic Die Bonding Die Bonding

Discover how Carl Jacobsson, Group Production Manager at Mycronic in Täby, Sweden, revolutionizes production by implementing a ‘lean management’ approach. Learn about waste reduction,

AI is not artificial - it’s real and powerful. Discover how Mycronic leverages AI to improve forecasting, inspection and maintenance in manufacturing.

Beyond tech: Mycronic’s vision for sustainable innovation You might think that sustainable innovation is all about technical advancements, but this concept can be much broader. We believe that

A record finish to a record year in Q4, 2023 - CEO commenting on report After a record finish to a record year in Q4, 2023, we are happy to share our Year-end Report January-December 2023.

Tekniksprånget 2020 Tekniksprånget 2020 An internship that takes the leap into technology The Swedish initiative Tekniksprånget (Technology Leap) is a four-month paid internship program

5G technology, with 100 times faster speeds than 4G, opens up new possibilities for consumers and businesses. And it’s already placing tough demands on manufacturers as well!

Mycronic joins United Nations Global Compact Mycronic joins United Nations Global Compact Sustainability is a key element of Mycronic’s business strategy and we are continuously working to

Discover how Mycronic’s innovative products, such as the SLX mask writer, can help the electronics sector achieve climate neutrality by saving energy and reducing waste.

Mycronic AB Box 3141,  18303 Täby, Sweden Phone: +46 8 638 52 00 E-Mail: info@mycronic.com   CEO: Anders Lindqvist Company Registration Number: 556351-2374 VAT Number:

Mycronic Fukuoka Mycronic Assembly Solutions Co. Ltd. 1-9-25, Enokida, Hakata-ku 812-0004 Fukuoka Japan +81 92 260 7009 +81 92 260 7019 Mycronic, Fukuoka, Japan

When it comes to epoxy dispensing your vendor system must offer the ultimate flexible platform for demanding environments. The epoxy dispenser should meet the highest standards of reliability and

NORTH BILLERICA, Mass., March 6, 2018 – MRSI Systems, a leading provider of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems is pleased to announce that our

Billerica, Mass., Oct, 6, 2017 – MRSI Systems, a leading manufacturer of fully automated, ultra-precision, high speed die bonding and epoxy dispensing systems, has been awarded new funding by the

On December 28, 2023, MRSI (Mycronic Group) received the “Infostone 2023 Optical Communication Most Competitive Equipment” award for the MRSI-705HF 5 micron high force die bonder at the First

The MRSI-705 features an innovative design with a versatile thirteen-position tool bank for quick, automatic tool changes. Enhanced functionality is achieved with additional tool change banks,

In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design

The International Microwave Symposium (IMS) is an annual conference that brings together the brightest minds in the microwave and RF industry. This year's event will take place in San Diego, CA,

Experience MRSI Systems at the IMAPS device packaging conference in Fountain Hills, Arizona. MRSI excitedly sponsors the 19th Annual Device Packaging Conference that will be held March 13th-16th

Achieving precise and reliable die bonding is crucial in numerous industries, especially when demanding a high degree of parallelism between bonding surfaces.

The MRSI-705 5-micron flip-chip die bonder has the largest installed base in photonics packaging, microwave modules, RF power amplifiers, infrared sensors, and medical devices.

MRSI Systems（Mycronic Group）很高兴地宣布贺尉宗(Hendry He)担任我们的中国区销售总监。他将与现有的销售团队及销售代表一起工作，并作为中国区销售代表服务市场，工作地点为上海。Hendry在半导体设备方面拥有丰富的技术知识以及销售经验。结合Hendry对中国市场的庞大网络的掌握Hendry的加入将进一步提高我们对客户需求的响应能力。

MRSI Systems (Mycronic Group) is pleased to announce our new China Country Sales Director, Hendry He. He will be working alongside the existing sales team and representatives in the region and is

die-bonding Laser Focus World Innovators Award 2023 MRSI Systems wins Silver Honoree for Laser Focus World Innovators Award 2023 MRSI Systems, a part of Mycronic Group, a leading manufacturer of

MRSI Systems (Mycronic Group), is launching the MRSI-H3LD, a new 3 micrometer high speed die bonder, optimized for bonding large dies for high power diode lasers, that are used in advanced

die-bonding MRSI Mycronic IMAPS New England 2025 Join MRSI Mycronic at IMAPS New England in May! MRSI Mycronic will be exhibiting, sponsoring, and presenting at the IMAPS New England event on May