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Join MRSI at the China International Optoelectronic Conference (CIOE)

At the exhibition, MRSI will provide live product demos of the recently launched MRSI-H-HPLD+, a new variant of the successful MRSI-H-HPLD that is tailored for high-power laser die attachment

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Advancing automation: unleashing the power of the automatic tool changing turret

In the world of chip packaging and advanced die bonding, the pursuit of efficiency, accuracy, and productivity is a continuous endeavor. MRSI’s die bonding systems offer a cutting-edge patented

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MRSI New Solution: Tape Holder

If you are looking to pick from tape and do not have a tape and real feature on your machine, then we have a solution for you. The two inch metal tape holder can accommodate four two-inch strips

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The MRSI-H1 Family: Unleashing Precision and Agility

The MRSI-H1 family of 1-micron flip-chip die bonders stands out as an advanced ultra-precision solution.

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Join us at IMAPS in San Diego!

MRSI Systems, Mycronic Group will be exhibiting at the 56th International Symposium on Microelectronics from October 3-4th, 2023 in San Diego, CA. This year's Symposium will feature 5

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MRSI Air-Knife Needle Cleaning System

MRSI recently introduced the air-knife vacuum system for cleaning epoxy dispense needles and it is now a standard feature on all MRSI dispense systems.

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MRSI为5G无线网络光电器件推出新型MRSI-H3TO贴片机产品

MRSI系统公司(Mycronic集团)推出MRSI-H3TO新型3微米高速贴片机,这是业界第一款可以真正满足多晶片和多流程的要求,可实现行业领先的贴片速度、卓越的灵活性以及为未来产品准备的3微米贴片精度。 MRSI-H3TO专为WDM与EML-TO或其他多晶片多流程TO-can光电器件量身打造,以支持即将普及的5G无线网络。

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MRSI Systems推出用于新应用的MRSI-HVM3P新产品

die-bonding MRSI Systems推出用于新应用的MRSI-HVM3P新产品 MRSI Systems(Mycronic集团)8月20日在美国马萨诸塞州扩展其业界领先的MRSI-HVM3高速贴片机机平台,推出MRSI-HVM3P新款机型,为有源光缆(AOC)、管盒(Gold-box)封装 以及 基板芯片(CoC)之外 的其他应用提供优化配置。

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MRSI Systems推出新型MRSI-H3LD高速贴片机

MRSI系统公司(Mycronic集团)推出MRSI-H3LD新型3微米高速贴片机,专用于大功率半导体激光器中的芯片贴片,广泛应用于工业激光器、光纤放大、光源和传感器等先进光电子应用。

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MRSI宣布在中国深圳建立HVM3芯片贴装演示能力

MRSI Systems(Mycronic集团)宣布在其位于深圳龙华的姐妹公司,深圳市轴心自控技术有限公司工厂建立一项新的演示能力。我们将根据客户的样品材料,安排并提供我们市场领先的MRSI-HVM3产品的本地演示以及芯片贴装应用。

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MRSI Launches New MRSI-H3TO Die Bonding Product Family Targeted at the 5G Wireless Network Supply Chain

STOCKHOLM, Aug 29, 2018 — MRSI Systems (Mycronic Group) is launching the MRSI-H3TO, a new 3 micrometer high speed die bonder which will be the first of its kind to address the multi-die and

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MRSI Announces HVM3 Die Bonding Demonstration Capability in Shenzhen China

STOCKHOLM, Nov 9, 2018 — MRSI Systems (Mycronic Group) announces new demonstration capability at its sister company, Shenzhen Axxon Automation (Mycronic Group) facility in the Longhua district,

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News

News die-bonding

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MRSI-175Ag – A flexible epoxy dispensing solution

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

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Jon Medernach to retire after a triumphant twenty years at MRSI Systems

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

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MRSI-H-HPLD 1.5 micron Die Bonder Won the Award for “Infostone 2022 Outstanding Technology”

MRSI Systems wins 2022 Infostone award for outstanding technology for their world-renowned die bonder!

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Visit MRSI at SEMICON West in San Francisco

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA.

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Learn more about MRSI’s Training Programs

die-bonding Learn more about MRSI’s Training Programs MRSI is currently offering training programs at our Tewksbury, MA facility. These courses are taught by dedicated trainers who are MRSI

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MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

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Experience MRSI’s latest innovations at the OFC Exhibition

MRSI will be a featured exhibitor at the OFC Exhibition. The OFC Exhibition is a unique and premium opportunity to immerse yourself into the photonics industry.  

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Watch MRSI’s Software Training Videos

die-bonding Watch MRSI’s Software Training Videos MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These

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MRSI to present and attend Auto Lidar Tech 2023

MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR

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Newsletters archive

Find and download archives of the MRSI Newsletter. Find great stories, articles and more or catch up on previous articles.

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MRSI Systems Automated Microwave Hybrid Manufacturing at TESAT-Spacecom (TESAT)

TESAT’s challenge was to develop an “Automated Microwave Factory” to manufacture complex highly integrated LTCC microwave modules within the frequency range 2 to 77GHz, 24 hours per day including

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Advanced Vision Systems

Increasing demand for data and bandwidth requires high-volume manufacturing of photonics and RF electronics at a level we have never seen before.

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Cases

Automated processes help clients grow

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Contact us

Contact MRSI Systems in Massachusetts for product information, technical support and more. Contact MRSI Systems today for more information!

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Meet with MRSI

Meet with MRSI

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MRSI North America

MRSI is the leading manufacturer of fully automated, high-speed, high-precision and flexible eutectic and epoxy die bonding systems.

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