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MRSI’s die bonding systems are designed to address the challenges of chip packaging with a focus on efficiency, precision, and productivity. These systems feature an advanced, patented

Last year, MRSI Systems launched the MRSI-705HF high force die bonder, a new version of the trusted MRSI-705 that is perfect for sintering and thermocompression bonding applications.

die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705

The MRSI-175Ag Conductive Epoxy Dispenser handles the most demanding dispensing applications such as semiconductor packaging, Microwave & RF modules, multichip modules, optical modules,

March will be a busy month for device packaging exhibitions. Please join MRSI Mycronic at these upcoming events. We hope to see you there to discuss our latest new product innovations. Learn more

After over 40 years of a successful capital equipment sales career, Jon Medernach will be hanging up his hat and enjoying retirement at the end of the month. As we bid farewell to Jon, our North

SEMICON West, the premier event for the semiconductor industry, is set to take place on July 11-13th, 2023 in San Francisco, CA.

die-bonding LASER World of PHOTONICS CHINA 2023 MRSI Booth MRSI to exhibit at LASER World of PHOTONICS CHINA 2023 with live demos MRSI will exhibit at LASER World of PHOTONICS CHINA from July

die-bonding Watch MRSI’s Software Training Videos MRSI has released a comprehensive set of software training videos that are designed to help users get the most out of their MRSI Machines. These

MRSI will attend the 5th Auto Lidar Tech Forum from Jun 5-7th in Suzhou, China. This event will focus on the market trends, technological breakthroughs, and practical applications of LIDAR

Each component gets the right amount of solder paste with jet printing technology instead of stencil printing.

Introducing the all-new pick-and-place graphical user interface User-driven design An all-new pick-and-place graphical user interface (GUI) raises the visibility of vital process data while

SMT Solutions PCB assembly solutions Case stories Mycronic offers advanced PCB assembly solutions to help streamline the manufacturing process. Our solutions are designed with precision and

Mycronic Japan Mycronic Tokyo Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45 320

Mycronic China Shanghai, China Mycronic Co., Ltd (Shanghai Office) Unit 1002, 10th floor, E Block Lane 168, Da Duhe Road Putuo District, 200062 Shanghai P.R. China +86 21 3252 3785/86 +86 21 3252

Mycronic Germany Mycronic, Germany, Munich Mycronic GmbH Inselkammerstraße 10 D-82008 Unterhaching bei München +49 89 45 24 24 8 - 0 +49 89 45 24 24 8 - 80 Mycronic, Unterhaching, Germany

Mycronic France Mycronic France Mycronic S.A.S 1 rue de Traversière 94513 Rungis Cedex 1 France +33 1 41 80 15 80 +33 1 46 86 77 89 Mycronic, Rungis , France Yes, please contact me

High-Speed Stencil Printing for PCB Assembly Lines. Learn more!

pcb-assembly Offline programming From high volume coating machine to flexible, full featured, easy to program coating system Evolution of a coater MYCRONIC INTRODUCED the MYC50 conformal coating

pcb-assembly REMOTE AWARENESS AND STRATEGIC PLANNING RAPID JOB INTERVENTION AND RESOLUTION REDUCED COMPONENT WASTE MYCenter Analysis elevates production performance to your dashboard Enter the

At its headquarters in a high-tech industry hub in Brisbane, Australia, Elexon Electronics is investing in the future of advanced local manufacturing. For CEO Frank Faller, this means finding new

pcb-assembly Mycronic to chair initiative and roll out Hermes-compatible equipment in 2020 New M2M standard opens the door to Industry 4.0 There’s a new messenger in town and it’s called Hermes.

pcb-assembly Automating material handling through robotics Say hello to Leo the robot! Stock accuracy, traceability, and timely delivery of parts are key aspects of a material handling system.

pcb-assembly Ten key SMT trends you need to know The ten trends to keep an eye out for; automation, big data, AI, robotics, two global ecosystems, shorter production cycles, the full line's

pcb-assembly Paperless productivity – changeover guidance with Agilis Smart Bin. Agilis Smart Bin MISSING COMPONENTS. Sticky notes falling off. Hunting for information. The list of reasons for

pcb-assembly Controlled paset deposition How to achieve zero stencil defects Through Mycronic’s fully integrated 3D solder paste inspection and jet printing solution, you can automatically

Chief Judge of federal court in Boston knocks out Palomar’s claim of infringement for its “double pick” patent allegedly covering a manufacturing process; court rules that claimed method is “so

Taking action against what it asserts is pervasive and repeated infringement of four separate U.S. patents it owns, leading precision manufacturer MRSI Systems LLC has filed a patent infringement

MRSI Systems (Mycronic Group), submicron die bonder MRSI-S-HVM won the award for "The Most Competitive Optical Communications Product in 2020." The MRSI-S-HVM submicron die bonder was recognized

ICC讯 在CIOE 2020，MRSI SYSTEMS将推出一款新产品，高速、灵活的0.5微米 MRSI-S-HVM 贴片机，为硅光器件，协同封装的电子和光子芯片，以及晶圆级封装应用提供解决方案。