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SEMICON West 2018 – MRSI Systems’ Advanced Packaging Solutions
All major optical communication component manufacturers, data center transceiver suppliers, optical network technology groups and, in general, the world of photonics packaging have been facing an
Featured Article Laser Focus World: Challenges for photonics manufacturing in the new data center era
MRSI’s latest article in Laser Focus World’s August Issue Challenges for photonics manufacturing in the new data center era, discusses the high volume and high mix nature of photonics
MRSI Systems Announces “One Stop Shop” Die Bonding Solutions & Participation at CIOE and ECOC
MRSI Systems will be demonstrating our “One Stop Shop” capabilities at the 20th China International Optoelectronic Exposition (CIOE) at the Shenzhen Convention and Exhibition Center with our
Manufacturing Automation Case Study – Flexible High-Speed Die Bonding Automation Platform
The following excerpt from MRSI Systems latest article published in Laser Focus World Magazine demonstrates how the latest advanced automated die bonding systems are transforming the world of
Visit MRSI Systems at the European Conference on Optical Communications (ECOC) 2018 – Fully Automated Die Bonders
Visit MRSI Systems’ Booth (#577) to learn about our new die bonder product launches.
International Microelectronics Assembly and Packaging Society (IMAPS) Symposium 2018
MRSI Systems is exhibiting at the 51st International Symposium on Microelectronics from October 8-11, 2018 in Pasadena, California at the Pasadena Convention Center.
Photonics Manufacturing for the Hyperscale Data Center Era
This excerpt from MRSI Systems featured article in Laser Focus World highlights the photonics industry challenges of data center applications and how the photonics industry can respond:
MRSI Systems—New Process Pages
These Die Bonding process pages explain the central role that die bonding continues to play in the photonics, sensors and semiconductor industries.
MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications
die-bonding MRSI Systems – IEEE Tech Insider Webinar: The Challenges in High Volume Manufacturing of Photonic Devices for Data Center Applications Internet traffic has been growing at an
Highlights of the Microelectronics Symposium
The 51st International Symposium on Microelectronics was held at the Pasadena Convention Center in Pasadena, California this month. This symposium is the premier event for microelectronic
Automotive LIDAR Conference 2018: AI & Autonomous Vehicles
MRSI Systems exhibited at the Automotive LIDAR 2018 Expo and Conference in Detroit, Michigan last month. The conference focused not only on hardware solutions but software as well. The use of AI
MRSI Systems Participates in Local Photonics & Advanced Manufacturing Symposiums
MRSI exhibited at the Inaugural WPI/QCC Integrated Photonics Symposium, at WPI October 3, 2018, and Dr. Yi Qian, VP of Marketing, MRSI Systems participated in an industry panel including
Challenges in Die Bonding of Gallium Nitride High Power Devices
Gallium Nitride (GaN) materials have long been regarded as great alternatives and enhancements to GaAs and silicon-based counterparts for applications...
High Volume Manufacturing of Photonic Components and Modules
Increasing demand for data and bandwidth requires high volume manufacturing (HVM) of photonics devices. This expansion with double-digit growth rates...
MRSI Systems Presented at Massachusetts Integrated Photonics Manufacturing Supply Chain Meeting held at MIT in Conjunction with 2016 AIM Photonics / MIT Microphotonics Center Fall Meeting
On November 2, 2016, MRSI Systems participated in the Commercial and Business Opportunities panel discussions at Massachusetts (MA) Integrated Photonics Manufacturing Supply Chain Meeting at MIT.
MRSI Systems Integrates In Situ Light Measurement for AOC into Die Bonder
BILLERICA, MA — April 22, 2015 — MRSI Systems, a developer and manufacturer of turnkey chip placement and dispensing systems, has integrated in situ light measurement for Active Optical Cable
MRSI Systems – “One Stop Shop” Fully Automated Die Bonding Solutions
Our die bonders are historically regarded the leaders in flexibility, and during the last two years, we have expanded our die bonding families. These high speed die bonders deliver
Visit MRSI Systems at the Optical Fiber Conference in San Diego
The Optical Fiber Conference (OFC) will be held at the San Diego Conference Center in San Diego, CA, USA from March 3-7, 2019. The exhibition is from March 5-7. Visit the MRSI Systems’ Booth #4541
MRSI Systems is Exhibiting and Sponsoring SPIE Photonics West 2019
MRSI Systems will be exhibiting at SPIE Photonics West, held at the Moscone Center in San Francisco, CA, USA from February 5-7, 2019.
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Great Week at SPIE Photonics West 2019
Thank you to all of our existing customers and new customers who visited us at SPIE Photonics West. The turnout at the booth was filled with great discussions. The event was well attended with
Dr. Limin Zhou Joins MRSI Systems – Strategic Marketing
Dr. Zhou joined MRSI Systems in 2019 as the Senior Director of Strategic Marketing. He is located in China to help develop new projects, customers, applications and markets. He also helps
Visit MRSI Systems at SEMICON China 2019 in Shanghai
MRSI Systems is exhibiting at SEMICON China in Shanghai, March 20-22, 2019, at the Shanghai New International Expo Centre. Please stop by the CYCAD Century Science & Technology Booth #2567.
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility(2)
ICCSZ讯 近日,全自动,高速,高精度,灵活多功能的贴片系统的领先制造商MRSI Systems在中国深圳南山绿创云谷大厦的Mycronic展示中心正式开放。在MRSI Systems战略营销高级总监周利民博士的带领下,讯石人员参观了演示中心全貌并了解MRSI Systems的现状及MRSI-HVM3贴片设备的应用。
International Microwave Symposium 2019
die-bonding International Microwave Symposium 2019 MRSI Systems is exhibiting at IMS (Booth #686). The world’s largest Microwave and RF industry event is being held in Boston, MA this year at the
MRSI Systems World Class Customer Support – Jack Inocencio
Jack was recently promoted to Customer Service Manager, reflecting a long and successful career with MRSI solving customer challenges. In his 10 year career with the company, Jack has accumulated
Challenges and Solutions for Bonding Ultra-Small Ceramic End-Terminated Capacitors
Electronic components and packages continue the trend of miniaturization which drives demand for cost-effective assembly solutions for smaller components and packages. This is happening in end
Join MRSI Systems at SEMICON West 2019
MRSI Systems is exhibiting at SEMICON West (Booth #6163) from July 9-11th in San Francisco, CA at the Moscone Center.
Visit MRSI Systems Demonstration Center in Shenzhen – Mycronic Facility
MRSI Systems, a leading manufacturer of fully automatic, high-speed, high-precision, flexible and multi-functional die bonding systems, demonstration capability was officially opened at the
Flexible Automation Solutions to Accelerate LiDAR Automotive Applications
LiDAR is an integrated optical detection and measurement system. Compared with typical radar, LiDAR can provide high-resolution distance, velocity, and geometric images, which were originally used