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The power of partnership
A flexible full-service PCB assembly partner has been able to expand beyond PCB manufacturing.
Join us at the upcoming events!
MRSI Mycronic will be participating in several optical and device packaging exhibitions. We invite you to attend these upcoming events. We look forward to discussing our latest product
Lagerist (m/w/d)
in Voll- oder Teilzeit (mind. 30 Std./Woche), für unseren neuen Standort Wertheim-Reinhardshof Lagerist (m/w/d) Ihre Aufgaben: Sachgemäße Lagerung und innerbetrieblicher Transport von
Video: Mycronic årsbokslut januari-december 2024 - kommentarer från CEO och CFO
Se en kort sammanfattning av årsbokslutet Q4 2024 Mycronics årsbokslut januari-december Q4 2024 - kommentarer från CEO och CFO Idag publicerade vi vårt årsbokslut för
Bokslutskommuniké januari-december 2024
Bokslutskommuniké januari-december 2024 Fjärde kvartalet Orderingången uppgick till 2 381 (1 448) MSEK, en ökning med 64 procent Nettoomsättningen ökade med 5 procent
MRSI-A-L Active Aligner Wins Infostone 2024 Award for "Most Competitive Optical Communication Product"
On December 6, 2024, Infostone successfully held its 2024 Annual Summary and the 11th Heroes List Award live conference. Awards presented included "The Most Competitive Products of Optical
Mycronic erhåller order på Prexision 8 Entry Evo
Mycronic AB (publ) har erhållit en order på en Prexision 8 Entry Evo från en befintlig kund i Asien. Ordervärdet ligger i intervallet 10-12 MUSD. Systemet är planerat att
Mycronic erhåller order på två Prexision MMS
Mycronic AB (publ) har erhållit en inbytesorder på två Prexision MMS från en befintlig kund, för leverans till Asien. Ordervärdet ligger i intervallet 12-14 MUSD. Det
Mycronic erhåller första ordern på en Prexision 8000 Evo
Mycronic AB (publ) har erhållit den första ordern på en Prexision 8000 Evo från en befintlig kund, för leverans till Asien. Ordern ersätter en tidigare erhållen
MRSI Mycronic announces advanced high-speed 1µm die bonder MRSI-LEAP for ultra-high-volume manufacturing of AI optical module applications
MRSI Mycronic is proud to announce the launch of the MRSI-LEAP high-speed 1µm die bonder. This innovative equipment is designed for ultra-high-volume manufacturing of optical modules,
Innovating with solid-state lasers: Mycronic's commitment to climate change
Kristina Svanteson and Sara Mårtenson in a meeting about sustainbility Innovating with solid-state lasers: Mycronic's commitment to climate change Mycronic is committed to do its part to
Inbjudan till presentation av Mycronics fjärde kvartal 2024
Analytiker, investerare och media bjuds in till presentationen av Mycronics fjärde kvartal 2024. Presentationen sker den 6 februari 2025, klockan 10:00. Rapporten publiceras den 6 februari
Events
dispensing-and-coating
News
dispensing-and-coating
About us
About us Axxon Automation Co., Ltd. Axxon, founded in 2008, is a Chinese manufacturer in the field of fluid automation, focusing on providing precision dispensing, coating, industrial dispensing
Dispensing and Coating
Discover Mycronic's high-precision dispensing and coating solutions designed for various industrial applications. Enhance your production with our innovative MYSmart series featuring
Press and Media > SV
Mycronic Japan Yokohama
Mycronic Yokohama Mycronic Yokohama Mycronic Assembly Solutions Co., Ltd. 1st floor Yokohama Nishiguchi KN Bldg. 2-8-4 Kitasaiwai Nishi-ku, 220-0004 Yokohama-City Kanagawa Prefecture Japan +81 45
Best Technology Award Founder
bare-board-testning atg Luther & Maelzer GmbH won the "Best Technology Award" of Founder PCB in 2024 On January 10, 2025, the 2024 Founder PCB Supplier Conference was held in Zhuhai.
Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea?
Did you know Mycronic die bonders aid in creating medical sensors as part of the treatment for sleep apnea? Mycronic die bonders are utilized in the production of medical sensors for treating
Explore Innovations in Optics and Photonics at SPIE Photonics West 2025
Plan now to visit our booth #5407 at SPIE Photonics West, January 28–30, 2025 in San Francisco, CA. Discover our latest technologies, including newly released active alignment solutions and the
Did you know that Mycronic can assemble electronic components as tiny as a grain of sand?
Did you know that Mycronic can assemble electronic components as tiny as a grain of sand? Our MYPro A40 pick-and-place is at the heart of this incredible precision. These advanced machines are
MRSI-LEAP High-Speed Die Bonders
The MRSI-LEAP 1µm high-speed die bonder boasts a range of innovative features that make it an essential tool for high-volume manufacturing.
MRSI Mycronic to Sponsor and Exhibit at the 2025 Chiplet Summit
In January 2025, MRSI Mycronic will sponsor and exhibit at the prestigious Chiplet Summit. This event gathers global leaders in semiconductor technology to discuss innovations in chiplet design
One out of every two smartphones use dispensing technology from Mycronic’s High Volume division
One out of every two smartphones use dispensing technology from Mycronic's High Volume division Axxon, the core of Mycronic's High Volume division, is the leading supplier in the field of
The Speed of Light and the Future of Photonic Wire Bonding
The Speed of Light and the Future of Photonic Wire Bonding Light, traveling at an astonishing speed of nearly 300,000 kilometers per second in a vacuum, can circumnavigate the Earth about seven and
Mycronic erhåller order på en SLX-maskritare
Mycronic AB (publ) har erhållit en order på en SLX-maskritare från en befintlig kund i Asien. Ordervärdet ligger i intervallet 6-8 MUSD. Systemet är planerat att levereras
The false call killer
pcb-assembly — a Q & A with Romain Roux and Nicolas Guillot on DeepReview and the power of AI-driven inspection The false call killer Some call it the “false call killer”: a new Automatic
User-driven design S series
pcb-assembly — how the new MYPro S series brings high-volume performance to high-flex manufacturing User-driven design “Our customers are growing. But they should never outgrow their investment,”
Versatile package handling capabilities: dewar and beyond
die-bonding MRSI-705 with wafer, conveyor Versatile package handling capabilities: dewar and beyond In today's fast-paced production environments, efficiency and versatility are key. The MRSI-705